|
|
|
Volumn , Issue , 1996, Pages 299-301
|
|
Thermo-mechanical creep characteristics of electrically conductive epoxy adhesives at room temperature
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
CONDUCTIVE PLASTICS;
CREEP;
ELECTRIC CONDUCTIVITY OF SOLIDS;
EPOXY RESINS;
SOLDERED JOINTS;
STRAIN RATE;
THERMAL EFFECTS;
THERMOMECHANICAL TREATMENT;
ELECTRICALLY CONDUCTIVE EPOXY ADHESIVES;
THERMOMECHANICAL CREEP;
PLASTIC ADHESIVES;
|
|
EID: 0029698699
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (3)
|
|
References (10)
|
