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Journal of Nanoscience and Nanotechnology

Volumn 14, Issue 2, 2014, Pages 2001-2011

Development and applications of 3-dimensional integration nanotechnologies

(4) Kim, Areum a Choi, Eunmi a Son, Hyungbin a Pyo, Sung Gyu a

a Chung Ang University (South Korea)

Author keywords

3D Integration; Biosensor; Bonding Strength; CMOS Sensor; Tsv

Indexed keywords

COMPUTER AIDED DESIGN; ELECTRONICS; EQUIPMENT; EQUIPMENT DESIGN; EQUIPMENT FAILURE; NANOTECHNOLOGY; REVIEW; SIGNAL PROCESSING; SYSTEM ANALYSIS; TRANSDUCER;

COMPUTER-AIDED DESIGN; ELECTRONICS; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; NANOTECHNOLOGY; SIGNAL PROCESSING, COMPUTER-ASSISTED; SYSTEMS INTEGRATION; TRANSDUCERS;

EID: 84894140003 PISSN: 15334880 EISSN: 15334899 Source Type: Journal
DOI: 10.1166/jnn.2014.8758 Document Type: Review

Times cited : (11)

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