3D integration technology for lab-on-a-chip applications

Electronics Letters

Volumn 47, Issue 26, 2011, Pages

  Temiz, Y ^a   Kilchenmann, S ^a   Leblebici, Y ^a   Guiducci, C ^a  

^a EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BIOSENSING; COMMERCIALISATION; FULLY INTEGRATED; LAB-ON-A-CHIP APPLICATIONS; LAB-ON-A-CHIP SYSTEMS; LOW COSTS; NEW DIMENSIONS; PERSONALISED MEDICINES; VERTICAL INTERCONNECTIONS;

ELECTRONICS ENGINEERING; TECHNOLOGY;

THREE DIMENSIONAL;

EID: 84555220507     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el.2011.2683     Document Type: Article

References (19)

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