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Journal of Electronic Materials

Volumn 38, Issue 12, 2009, Pages 2449-2454

Effect of wet pretreatment on interfacial adhesion energy of Cu-Cu thermocompression bond for 3D IC packages

(4) Jang, Eun Jung a Hyun, Seungmin b Lee, Hak Joo b Park, Young Bae a

a Andong National University (South Korea)

b Korea Institute of Machine and Materials (South Korea)

Author keywords

3D IC; Cu Cu bond; Interfacial adhesion energy; Wet pretreatment

Indexed keywords

ADHESION STRENGTHS; BONDING LAYERS; CU FILMS; FOUR-POINT BENDING METHOD; IC PACKAGE; INTERFACIAL ADHESION ENERGY; INTERFACIAL CRACKS; OVER-ETCHING; PLASTIC DISSIPATION; PRE-TREATMENT; PRETREATMENT CONDITIONS; QUANTITATIVE ANALYSIS; THERMOCOMPRESSION BONDS; WET-ETCH;

ADHESION; COPPER; SURFACE PROPERTIES; THREE DIMENSIONAL;

INTERFACIAL ENERGY;

EID: 72549107064 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0942-9 Document Type: Article

Times cited : (81)

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