-
1
-
-
84870778050
-
-
US Patent No. 2791760
-
I. M. Ross, US Patent No. 2791760 (1957).
-
(1957)
-
-
Ross, I.M.1
-
4
-
-
0024143721
-
-
S. S. Eaton, D. B. Butler, M. Parris, D. Wilson, and H. McNeille, IEEE Intern. Solid State Circuits Conf. Digest of Technical Papers (1988), p. 130.
-
(1988)
IEEE Intern. Solid State Circuits Conf. Digest of Technical Papers
, pp. 130
-
-
Eaton, S.S.1
Butler, D.B.2
Parris, M.3
Wilson, D.4
McNeille, H.5
-
7
-
-
80052804532
-
-
T. S. Böscke, J. Müller, D. Bräuhaus, U. Schröder, and U. Böttger, Appl. Phys. Lett. 99, 102903 (2011).
-
(2011)
Appl. Phys. Lett.
, vol.99
, pp. 102903
-
-
Böscke, T.S.1
Müller, J.2
Bräuhaus, D.3
Schröder, U.4
Böttger, U.5
-
9
-
-
33846411848
-
-
C.-Y. Koo, J.-H. Cheon, J.-H. Yeom, J. Ha, S.-H. Kim, and S.-K. Hong, J. Korean Phys. Soc. 49, S514 (2006).
-
(2006)
J. Korean Phys. Soc.
, vol.49
-
-
Koo, C.-Y.1
Cheon, J.-H.2
Yeom, J.-H.3
Ha, J.4
Kim, S.-H.5
Hong, S.-K.6
-
10
-
-
76649120587
-
-
M.-H. Tang, G.-J. Dong, Y. Sugiyama, and H. Ishiwara, Semicond. Sci. Technol. 25, 035006 (2010).
-
(2010)
Semicond. Sci. Technol.
, vol.25
, pp. 035006
-
-
Tang, M.-H.1
Dong, G.-J.2
Sugiyama, Y.3
Ishiwara, H.4
-
12
-
-
0037436499
-
-
J. Wang, J. B. Neaton, H. Zheng, V. Nagarajan, S. B. Ogale, B. Liu, D. Viehland, V. Vaithyanathan, D. G. Schlom, U. V. Waghmare, N. A. Spaldin, K. M. Rabe, M. Wuttig, and R. Ramesh, Science 299, 1719 (2003).
-
(2003)
Science
, vol.299
, pp. 1719
-
-
Wang, J.1
Neaton, J.B.2
Zheng, H.3
Nagarajan, V.4
Ogale, S.B.5
Liu, B.6
Viehland, D.7
Vaithyanathan, V.8
Schlom, D.G.9
Waghmare, U.V.10
Spaldin, N.A.11
Rabe, K.M.12
Wuttig, M.13
Ramesh, R.14
-
14
-
-
40849126982
-
-
Y. H. Chu, Q. Zhan, C.-H. Yang, M. P. Cruz, L. W. Martin, T. Zhao, P. Yu, R. Ramesh, P. T. Joseph, I. N. Lin, W. Tian, and D. G. Schlom, Appl. Phys. Lett. 92, 102909 (2008).
-
(2008)
Appl. Phys. Lett.
, vol.92
, pp. 102909
-
-
Chu, Y.H.1
Zhan, Q.2
Yang, C.-H.3
Cruz, M.P.4
Martin, L.W.5
Zhao, T.6
Yu, P.7
Ramesh, R.8
Joseph, P.T.9
Lin, I.N.10
Tian, W.11
Schlom, D.G.12
-
17
-
-
10444241773
-
-
S. Masui, T. Ninomiya, T. Ohkawa, M. Oura, Y. Horii, N. Kin, and K. Honda, IEICE Trans. Electron. E87-C, 1769 (2004).
-
(2004)
IEICE Trans. Electron.
, vol.E87-C
, pp. 1769
-
-
Masui, S.1
Ninomiya, T.2
Ohkawa, T.3
Oura, M.4
Horii, Y.5
Kin, N.6
Honda, K.7
-
20
-
-
8644248309
-
-
K. Aizawa, B.-E. Park, Y. Kawashima, K. Takahashi, and H. Ishiwara, Appl. Phys. Lett. 85, 3199 (2004).
-
(2004)
Appl. Phys. Lett.
, vol.85
, pp. 3199
-
-
Aizawa, K.1
Park, B.-E.2
Kawashima, Y.3
Takahashi, K.4
Ishiwara, H.5
-
22
-
-
31544453603
-
-
K. Takahashi, K. Aizawa, B.-E. Park, and H. Ishiwara, Jpn. J. Appl. Phys. 44, 6218 (2005).
-
(2005)
Jpn. J. Appl. Phys.
, vol.44
, pp. 6218
-
-
Takahashi, K.1
Aizawa, K.2
Park, B.-E.3
Ishiwara, H.4
-
26
-
-
77957577788
-
-
T. Hatanaka, R. Yajima, T. Horiuchi, S. Wang, X. Zhang, M. Takahashi, S. Sakai, and K. Takeuchi, IEEE J. Solid-State Circuits 45, 2156 (2010).
-
(2010)
IEEE J. Solid-State Circuits
, vol.45
, pp. 2156
-
-
Hatanaka, T.1
Yajima, R.2
Horiuchi, T.3
Wang, S.4
Zhang, X.5
Takahashi, M.6
Sakai, S.7
Takeuchi, K.8
-
27
-
-
84870824916
-
-
Nagoya
-
X. Zhang, M. Takahashi, K. Takeuchi, and S. Sakai, Abstract of Intern. Conf. on Solid State Devices and Materials, Nagoya, F-3-1 (2011).
-
(2011)
Abstract of Intern. Conf. on Solid State Devices and Materials
-
-
Zhang, X.1
Takahashi, M.2
Takeuchi, K.3
Sakai, S.4
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