Low temperature nanointegration for emerging biomedical applications

Microelectronics Reliability

Volumn 52, Issue 2, 2012, Pages 361-374

  Howlader, Matiar M R ^a   Doyle, Thomas E ^a  

^a MCMASTER UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMEDICAL APPLICATIONS; BIOMEDICAL SENSORS; BIOMEDICAL SYSTEMS; BOTTOM-UP AND TOP-DOWN; COVALENT BONDING; DESIGN APPROACHES; ELECTRICAL CURRENT; EXTERNAL PRESSURES; HIGH FREQUENCY; INTELLIGENT SENSORS; LOW LOSS; LOW TEMPERATURES; LOW TOXICITY; MECHANICAL STRUCTURES; MINIATURIZED SYSTEMS; NANO-METER SCALE; REMOTE PATIENT MONITORING; RIGID AND FLEXIBLE SUBSTRATES; ROOM TEMPERATURE; SENSING SYSTEMS; SIMULTANEOUS DEPOSITION; TOPDOWN; VOID-FREE;

ADHESION; BIOSENSORS; GALLIUM ALLOYS; GALLIUM ARSENIDE; GALLIUM PHOSPHIDE; GOLD DEPOSITS; LIQUID CRYSTALS; MEDICAL APPLICATIONS; OPTICAL COMMUNICATION; PATIENT MONITORING; PATIENT REHABILITATION; SENSORS; SURFACE CLEANING;

ELECTRIC PROPERTIES;

EID: 84855907166     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.08.018     Document Type: Article

References (60)

1. J.V. Jokerst, J.W. Jacobson, B.D. Bhagwandin, P.N. Floriano, N. Christodoulides, and J.T. McDevitt Programmable nano-bio-chip sensors: analytical meets clinical Anal Chem 82 5 2010 1571 1579
2. P. Rolfe Medical and biological measurement with micro- and nano-sensors Optoelectron Instrument Proc 46 4 2010 324 328
3. D.M.G. Preethichandra, and E.M.I.M. Ekanayake Nano-biosensor development for biomedical and environmental measurements New Develop Appl Sens Technol 2011 279 292
4. M. Goldberg, R. Langer, and X. Jia Nanostructured materials for applications in drug delivery and tissue engineering J Biomater Sci Polym Ed 18 3 2007 241 268 (Pubitemid 46403135)
5. M. Liong, J. Lu, M. Kovochich, T. Xia, S.G. Ruehm, and A.E. Nel Multifunctional inorganic nanoparticles for imaging, targeting, and drug delivery ACS Nano 2 5 2008 889 896
6. H. Wang, M. Sun, K. Ding, M.T. Hill, and C.Z. Ning A top-down approach to fabrication of high quality vertical heterostructure nanowire arrays Nano Lett 11 4 2011 1646 1650
7. M. Schlipf, S. Bathurst, K. Kippenbrock, S.G. Kim, and G. Lanza A structured approach to integrate MEMS and precision engineering methods CIRP J Manufac Sci Technol 3 3 2011 236 247
8. P. Maury, M. Peter, V. Mahalingam, D.N. Reinhoudt, and J. Huskens Patterned self-assembly monolayers on silicon oxide prepared by nanoimprint lithography and their applications in nanofabrication Adv Func Mater 15 3 2005 451 457 (Pubitemid 40430439)
9. Q. Li, S.-M. Koo, C.A. Richter, M.D. Edelstein, J.E. Bonevich, and J.J. Kopanski Precise alignment of single nanowires and fabrication of nanoelectromechanical switch and other test structures IEEE Trans Nanotechnol 6 2 2007 256 263
10. L. Cao, S. Chen, D. Wei, Y. Liu, L. Fu, and G. Yu Fabrication and characterization of molecular scale field-effect transistors J Mater Chem 20 12 2010 2305 2309
11. R. Komanduri, J. Chen, A. Malshe, C. Doumanidis, and K. Rajurkar NSF-EC workshop on nanomanufacturing and processing: a summary report Proc SPIE 4936 2002 446 454
12. N. Yang, H. Uetsuka, O.A. Williams, E. Osawa, N. Tokuda, and C.E. Nebel Vertically aligned diamond nanowires: fabrication, characterization, and application for DNA sensing Phys Status Solidi A 206 9 2009 2048 2056
13. L.J. Guo Nanoimprint technology and its applications Proc SPIE 5734 2005 53 64 (Pubitemid 41121075)
14. S.E. Thompson, and S. Parthasarathy Moore's law: the future of Si microelectronics Mater Today 9 6 2006 20 25 (Pubitemid 43783458)
15. B.H. Lee, J. Oh, H.H. Tseng, R. Jammy, and H. Huff Gate stack technology for nanoscale devices Mater Today 9 6 2006 32 40 (Pubitemid 43783459)
16. M.M.R. Howlader, P.R. Selvaganapathy, M.J. Deen, and T. Suga Nanobonding technology toward electronic, fluidic and photonic systems integration IEEE J Select Topics Quant Elect 17 3 2011 689 703
17. F. Crnogorac, S. Wong, and R.F.W. Pease Semiconductor crystal islands for three-dimensional integration J Vac Sci Technol B 28 6 2010 C6P53-C6P58
18. A.M. Kiefer, D.M. Paskiewicz, A.M. Clausen, W.R. Buchwald, R.A. Soref, and M.G. Lagally Si/Ge junctions formed by nanomembrane bonding ACS Nano 5 2 2011 1179 1189
19. C.S. Tan Thermal characteristic of Cu-Cu bonding layer in 3-D integrated circuits stack Microelectron Eng 87 4 2010 682 685
20. T.J. Karle, Y. Halioua, F. Raineri, P. Monnier, R. Braive, and L. Le Gratiet Heterogeneous integration and precise alignment of InP-based photonic crystal lasers to complementary metal-oxide semiconductor fabricated silicon-on-insulator wire waveguides J Appl Phys 107 6 2010 063103 063111
21. P.C.K. Vesborg, J.L. Olsen, T.R. Henriksen, I. Chorkendorff, and O. Hansen Note: anodic bonding with cooling of heat-sensitive areas Rev Scient Instrum 81 2010 016111 016113
22. Schultz AE, Kuiken TA. Neural interfaces for control of upper limb prostheses: The state of the art and future possibilities. 2011;3(1):55-67.
23. R.B. Stein, and V. Mushahwar Reanimating limbs after injury or disease Trends Neurosci 28 10 2005 518 524 (Pubitemid 41316302)
24. G. Di Pino, E. Guglielmelli, and P.M. Rossini Neuroplasticity in amputees: main implications on bidirectional interfacing of cybernetic hand prostheses J Prog Neurobiol 88 2 2009 114 126
25. M.J. Kane, P.P. Breen, F. Quondamatteo, and G. ÓLaighin BION microstimulators: a case study in the engineering of an electronic implantable medical device J Med Eng Phys 33 1 2011 7 16
26. P. Brunner, L. Bianchi, C. Guger, F. Cincotti, and G. Schalk Current trends in hardware and software for brain-computer interfaces (BCIs) J Neural Eng 8 2 2011 1 7
27. D.J. McFarland, and J.R. Wolpaw Brain-computer interfaces for communication and control J Commun ACM 54 5 2011 60 66
28. K.A. Stubblefield, L.A. Miller, R.D. Lipschutz, and T.A. Kuiken Occupational therapy protocol for amputees with targeted muscle reinnervation J Rehab Res Dev 46 4 2009 481 488
29. P. Brunner, A.L. Ritaccio, J.F. Emrich, H. Bischof, and G. Schalk Rapid communication with a P300 matrix speller using electrocorticographic signals (ECoG) Front Neurosci 5 0 2011 9
30. G. Pfurtscheller, C. Guger, G. Müller, G. Krausz, and C. Neuper Brain oscillations control hand orthosis in a tetraplegic Neurosci Lett 292 2000 211 214
31. E.T. Richey, and R. Namon EEG instrumentation and technology 1976 Charles C. Thomas
32. R.F.F. Weir, P.R. Troyk, G.A. DeMichele, D.A. Kerns, J.F. Schorsch, and H. Maas Implantable myoelectric sensors (IMESs) for intramuscular electromyogram recording IEEE Trans Biomed Eng 56 2009 159 171
33. Oostenveld R. ECoG brain dynamics in high-resolution recordings. In: 5th BCI2000 workshop & international workshop on advances in electrocorticography. NY, USA: Bolton Landing; October 1-3, 2009.
34. Leuthardt EC. Utilization of BCI for potential treatment of hemispheric stroke. in: 5th BCI2000 workshop & international workshop on advances in electrocorticography. NY, USA: Bolton Landing; October 1-3, 2009.
35. J. Kubánek, K.J. Miller, J.G. Ojemann, J.R. Wolpaw, and G. Schalk Decoding flexion of individual fingers using electrocorticographic signals in humans J Neural Eng 6 6 2009 066001 066014
36. G. Schalk, K.J. Miller, N.R. Anderson, J.A. Wilson, M.D. Smyth, and J.G. Ojemann Two-dimensional movement control using electrocorticographic signals in humans J Neural Eng 5 2008 75 84 (Pubitemid 351366605)
37. Ledochowitsch P, Félus RJ, Gibboni RR, Miyakawa, Bao S, Maharbiz MM. Fabrication and testing of a large area, high density, parylene MEMS μECoG array. In: IEEE 24th International Conference on Micro Electro Mechanical Systems (MEMS), 2011; 2011. p. 1031-4.
38. C. Li, F.E. Sauser, R.G. Azizkhan, C.H. Ahn, and I. Papautsky Polymer flip-chip bonding of pressure sensors on a flexible Kapton film for neonatal catheters J Micromech Microeng 15 2005 1729 1735 (Pubitemid 41205555)
39. W. Lu, and C.M. Lieber Nanoelectronics from the bottom up Nat Mater 6 2007 841 849
40. C. Kirchner, M. George, B. Stein, W.J. Parak, H.E. Gaub, and M. Seitz Corrosion protection and long-term chemical functionalization of gallium arsenide in an aqueous environment Adv Func Mater 12 4 2002 266 276 (Pubitemid 34505433)
41. W.K. Leau, J.P. Chu, and C.H. Lin Interfacial reaction and electrical characteristics of Cu(RuTaNx) on GaAs: annealing effects Appl Surf Sci 257 16 2011 7286 7290
42. T. Yu, M.M.R. Howlader, F. Zhang, and M. Bakr Nanobonding for multi-junction solar cells at room temperature ECS Trans 35 2 2011 3 10
43. M.M.R. Howlader, F. Zhang, M.J. Deen, T. Suga, and A. Yamauchi Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature J Vac Sci Technol A 29 2010 021007 021017
44. M.M.R. Howlader, A. Yamauchi, and T. Suga Surface activation based nano-bonding and interconnection at room temperature J Micromech Microeng 21 2 2011 025009 025010
45. X. Wang, W. Zeng, and E. Eisenbraun Sub-0.25 micron silicon via etching for 3D Interconnects J Micromech Microeng 17 2007 804 811 (Pubitemid 46778438)
46. S. Spiesshoefer, J. Patel, T. Lam, L. Cai, S. Polamreddy, and R.F. Figueroa Copper electroplating to fill blind vias for three-dimensional integration J Vac Sci Technol A 24 4 2006 1277 1282 (Pubitemid 43959153)
47. N. Tanaka, Y. Yoshimura, M. Kawashita, T. Uematsu, C. Miyazaki, and N. Toma Through-silicon via interconnection for 3D integration using room-temperature bonding IEEE Trans Adv Packag 32 4 2009 746 753
48. T.D. Wang, and J.V. Dam Optical biopsy: a new frontier in endoscopic detection and diagnosis Clin Gastroenterol Hepatol 2 9 2004 744 753 (Pubitemid 39200712)
49. M. Kfouri, O. Marinov, P. Quevedo, N. Faramarzpour, S. Shirani, and L.W.-C. Liu Towards a miniaturized wireless fluorescence-based diagnostic imaging system IEEE J Select Topics Quant Elect 14 10 2008 226 234 (Pubitemid 351270784)
50. M. El-Desouki, M.J. Deen, Q. Fang, L. Liu, F. Tse, and D. Armstrong CMOS image sensors for high speed applications Sensors 9 1 2009 430 444
51. Cavalcanti A, Rosen L, Shirinzadeh B, Rosenfeld M. Nanorobot for treatment of patients with artery occlusion. Proc Virtual Concept; 2006.
52. M.M.R. Howlader, and F. Zhang Void-free strong bonding of surface activated silicon wafers from room temperature to annealing at 600 °C Thin Solid Films 519 2010 804 808
53. M.M.R. Howlader, T. Suga, F. Zhang, T.H. Lee, and M.J. Kim Interfacial behavior of surface activated p-GaP/n-GaAs bonded wafers at room temperature Electrochem Solid State Lett 13 3 2010 H61 H65
54. H. Takagi, R. Maeda, N. Hosoda, and T. Suga Transmission electron microscope observations of Si/Si interface bonded at room temperature by Ar beam surface activation Jpn J Appl Phys 38 3A 1999 1589 1594
55. A.W. Fang, H. Park, R. Jones, O. Cohen, M.J. Paniccia, and J.E. Bowers Heterogeneous integration of silicon and AlGaInAs for a silicon evanescent laser Proc SPIE 6133 2006 61330W1-61330W8
56. M.M.R. Howlader, T. Watanabe, and T. Suga Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature J Vac Sci Technol B 19 6 2001 2114 2118 (Pubitemid 34096691)
57. T. Stieglitz, H. Beutel, and J. Meyer Microflex - a new assembling technique for interconnects J Intell Mater Sys Struc 11 6 2000 417 425 (Pubitemid 32272819)
58. M.M.R. Howlader, M. Iwashita, K. Nanbu, K. Saijo, and T. Suga Enhanced Cu/LCP adhesion by pre-sputter cleaning prior to Cu deposition IEEE Trans Adv Packag 28 3 2005 495 502 (Pubitemid 41263755)
59. K. Nanbu, S. Ozawa, K. Yoshida, K. Saijo, and T. Suga Low temperature bonded Cu/LCP materials for FPCs and their characteristics IEEE Trans Compon Packag Technol 28 4 2005 760 764 (Pubitemid 41825217)
60. M.M.R. Howlader, T. Suga, A. Takahashi, K. Saijo, S. Ozawa, and K. Nanbu Surface activated bonding of LCP/Cu for electronic packaging J Mater Sci 40 12 2005 3177 3184 (Pubitemid 40834140)