Formation of Cu-Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum

Applied Physics Letters

Volumn 90, Issue 15, 2007, Pages

  Tadepalli, Rajappa ^a   Thompson, Carl V ^a  

^a Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND TOUGHNESS; METAL-METAL BONDING; THREE-DIMENSIONAL CIRCUIT FABRICATION;

ADHESIVES; ATOMIC FORCE MICROSCOPY; COPPER COMPOUNDS; HYDROGEN BONDS; TENSILE STRESS; ULTRAHIGH VACUUM;

INTERFACES (MATERIALS);

EID: 34247209718     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2720297     Document Type: Article

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