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Volumn 402, Issue 3, 2012, Pages 1011-1018
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Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process
a,b
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Author keywords
Bonding; Glass; Low temperature; Nanochannel; Nanofluidics; Plasma
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Indexed keywords
AIR PRESSURES;
AMBIENT AIR;
BONDING PROCESS;
BONDING STRENGTH;
DIRECT BONDING;
FABRICATION TECHNOLOGIES;
FUNCTIONAL ELEMENTS;
FUSION BONDING;
HIGH PRESSURE;
HIGH RESOLUTION;
HIGH TEMPERATURE;
LOW TEMPERATURE BONDING;
LOW TEMPERATURES;
NANO CHANNELS;
NANO SCALE;
PLASMA SURFACES;
REACTIVE ION;
REPRODUCIBILITIES;
VACUUM CONDITION;
ATMOSPHERIC PRESSURE;
BONDING;
FUSED SILICA;
GLASS;
HIGH TEMPERATURE OPERATIONS;
NANOFLUIDICS;
NITROGEN PLASMA;
PLASMA APPLICATIONS;
PLASMAS;
REACTIVE ION ETCHING;
TWO DIMENSIONAL;
VACUUM APPLICATIONS;
GLASS BONDING;
GLASS;
SILICON DIOXIDE;
ARTICLE;
CHEMISTRY;
EQUIPMENT DESIGN;
INSTRUMENTATION;
MICROFLUIDIC ANALYSIS;
SURFACE PROPERTY;
TEMPERATURE;
EQUIPMENT DESIGN;
GLASS;
MICROFLUIDIC ANALYTICAL TECHNIQUES;
SILICON DIOXIDE;
SURFACE PROPERTIES;
TEMPERATURE;
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EID: 84856233950
PISSN: 16182642
EISSN: 16182650
Source Type: Journal
DOI: 10.1007/s00216-011-5574-2 Document Type: Article |
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Times cited : (92)
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References (26)
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