A cavity chip interconnection technology for thick MEMS chip integration in MEMS-LSI multichip module

Journal of Microelectromechanical Systems

Volumn 19, Issue 6, 2010, Pages 1284-1291

  Lee, Kang Wook ^a   Kanno, Soichiro ^a   Kiyoyama, Kouji ^a,b   Fukushima, Takafumi ^a   Tanaka, Tetsu ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b NAGASAKI INSTITUTE OF APPLIED SCIENCE   (Japan)

Author keywords

Beam lead; cavity chip; heterogeneous integration; microelectromechanical systems (MEMS) large scale integration (LSI) (MEMS LSI) multichip module; sidewall interconnection; through silicon via (TSV)

Indexed keywords

BEAM LEAD; CAVITY CHIP; HETEROGENEOUS INTEGRATION; MICROELECTROMECHANICAL SYSTEMS; SIDEWALL INTERCONNECTION; THROUGH-SILICON VIA;

INTEGRATION; LSI CIRCUITS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MULTICHIP MODULES; PRINTED CIRCUIT DESIGN;

COMPOSITE MICROMECHANICS;

EID: 78649666849     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2082497     Document Type: Article

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