Three-dimensional hybrid integration technology of CMOS, MEMS, and photonics circuits for optoelectronic heterogeneous integrated systems

IEEE Transactions on Electron Devices

Volumn 58, Issue 3, 2011, Pages 748-757

  Lee, Kang Wook ^a   Noriki, Akihiro ^a   Kiyoyama, Kouji ^a,b   Fukushima, Takafumi ^a   Tanaka, Tetsu ^a   Koyanagi, Mitsumasa ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b NAGASAKI INSTITUTE OF APPLIED SCIENCE   (Japan)

Author keywords

3 D hybrid integration; Chip self assembly; microfluidic channel; optoelectronic heterogeneous integrated system; Si interposer; through silicon via (TSV); waveguide

Indexed keywords

CHIP SELF-ASSEMBLY; HYBRID INTEGRATION; INTEGRATED SYSTEMS; MICROFLUIDIC CHANNEL; SI INTERPOSER; THROUGH-SILICON VIA (TSV);

CMOS INTEGRATED CIRCUITS; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; FLUIDIC DEVICES; INTEGRATED CONTROL; INTEGRATED OPTICS; INTEGRATION; LASERS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROFLUIDICS; MULTICHIP MODULES; PHOTONICS; SELF ASSEMBLY; SILICON; SILICON WAFERS; SURFACE EMITTING LASERS; TECHNOLOGY; THREE DIMENSIONAL; WAFER BONDING; WAVEGUIDES;

PHOTONIC INTEGRATION TECHNOLOGY;

EID: 79952043926     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2010.2099870     Document Type: Article

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