High-speed TSV filling with molten solder

Microelectronic Engineering

Volumn 89, Issue 1, 2012, Pages 62-64

  Ko, Young Ki ^a   Fujii, Hiromichi T ^b   Sato, Yutaka S ^b   Lee, Chang Woo ^a   Yoo, Sehoon ^a  

^a Korea Institute of Industrial Technology   (South Korea)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

Filling; Reflow; Solder; TSV; Vacuum; Via; Wave soldering

Indexed keywords

REFLOW; SOLDER; TSV; VIA; WAVE SOLDERING;

FILLING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; VACUUM;

SOLDERING;

EID: 81855163374     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.01.030     Document Type: Conference Paper

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