Alternative approach in 3D MEMS-IC integration using fluidic self-assembly techniques

Journal of Micromechanics and Microengineering

Volumn 19, Issue 10, 2009, Pages

  Chapuis, Y A ^a,b   Debray, A ^c   Jalabert, L ^a   Fujita, H ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

^b UNIVERSITÉ DE STRASBOURG   (France)

^c CANON INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3-D MEMS; ALTERNATIVE APPROACH; BONDING PROCESS; DIFFERENT SUBSTRATES; ELECTRICAL CONTACTS; ELECTRONIC CHIPS; FABRICATION METHOD; FABRICATION PROCESS; FLIP CHIP; FLUIDIC SELF-ASSEMBLY; LARGE SCALE INTEGRATION; LIQUID SOLDERS; MEMS CHIPS; SELF-ALIGNMENT PROCESS; SELF-ASSEMBLY TECHNIQUE; SOLDER BUMP; SPECIFIC PRESSURE; THERMAL HEATING;

CHEMICAL VAPOR DEPOSITION; FLIP CHIP DEVICES; MEMS; PLASMA DEPOSITION; SELF ASSEMBLY; SURFACE TREATMENT; THREE DIMENSIONAL;

MICROELECTROMECHANICAL DEVICES;

EID: 71049175802     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/10/105002     Document Type: Article

References (40)

1. Gauna E and Newman R 2006 Smart MEMS and Sensor Systems (Singapore: World Scientific)
2. Yazdi N, Ayazi F and Najafi K 1998 Micromachined inertial sensors Proc. IEEE 86 1640-59
3. Aden J S, Bohórquez J H, Collins D M, Crook M D, García A and Hess U E 1994 The third-generation HP thermal inkjet printhead Hewlett-Packard J. 41-5
4. Van Kessel P F, Hornbeck L G, Meier R E and Douglas M R A 1998 MEMS-based projection display Proc. IEEE 86 1687-704
5. Huikai X and Fedder G K 2001 A CMOS-MEMS lateral-axis gyroscope Proc. 14th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS 2001) pp 162-5
6. Fedder G K, Howe R T, Liu T J K and Quévy E P 2008 Technologies of cofabricating MEMS and electronics Proc. IEEE 96 306-22
7. Niklaus F, Hassl S and Stemme G 2003 Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding J. Microelectromech. Syst. 12 465-9
8. Niklaus F, Lu J Q, McMahon J J, Hu J, Lee S H, Cale T S and Gutmann R J 2005 Wafer level 3D integration technology platform for ICs and MEMS Proc. 20th Int. VLSI/ULSI Multilevel Interconnection Conf. 2005 pp 162-5
9. Bryzek J, Flannery A and Skurnik D 2004 Integrating microelectromechanical systems with integrated circuits IEEE Instrum. Meas. Mag. 7 51-9
10. Wang C H and Holmes A S 2001 Laser-assisted bumping for flip chip assembly IEEE Trans. Electron. Packag. Manuf. 24 109-14
11. Chu K M, Choi J H, Lee J S, Cho H S, Park S O, Park H H and Jeon D Y 2006 Optoelectronic and microwave transmission characteristics of indium solder bumps for low-temperature flip-chip applications IEEE Trans. Adv. Packag. 29 409-14
12. Zhang J, Wang C, Zeng J and Pang A J 2007 A low cost bumping method for flip chip assembly and MEMS integration IEEE Trans. Compon. Packag. Technol. 30 781-6
13. Yeh H J J and Smith J S 1994 Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates IEEE Photonics Technol. Lett. 6 706-8
14. Cohn M B, Bohringer K F, Noworolski J M, Singh A, Keller C G, Goldberg K Y and Howe R T 1998 Microassembly technologies for MEMS Proc. SPIE 3512 2-16
15. Syms R R A 1999 Surface tension powered self-assembly of 3-D micro-optomechanical structures J. Microelectromech. Syst. 8 448-55
16. Avital A and Zussman E 2006 Fluidic assembly of optical components IEEE Trans. Adv. Packag. 29 719-24
17. Debray A, Shibata M and Fujita H 2007 A low melting point alloy as a functional material for a one-shot microvalve J. Micromech. Microeng. 17 1142-450
18. Sariola V, Zhou Q and Koivo H N 2008 Hybrid microhandling: a unified view of robotic manipulation and self-assembly J. Micro-Nano Mechatronics 4 5-16
19. Morris C J and Parviz B A 2008 Micro-scale metal contacts for capillary force-driven self-assembly J. Micromech. Microeng. 18 1-9
20. Chapuis Y A, Debray A and Rose F 2008 Using self-assembly techniques in MEMS fabrication approach MEMS and its Material Technologies ed M Ichiki (Trandrum, India: Research Signpost) at press
21. Whitesides G M and Grzybowski B 2002 Self-assembly at all scales Science 295 2418-21
22. Boncheva M, Bruzewicz D A and Whitesides G M 2003 Millimeter-scale self-assembly and its applications Pure Appl. Chem. 75 621-30
23. Breen T L, Tien J, Oliver S R J, Hadzic T and Whitesides G M 1999 Design and self-assembly of open, regular, 3D mesostructures Science 284 948-51
24. Case M J, Shastry A and Böhringer K F 2005 Towards understanding contact angle hysteresis behavior of textured surfaces J. Undergrad. Res. Bioeng. 5 10-4
25. Fang J and Böhringer K F 2006 Parallel micro component-to-substrate assembly with controlled poses and high surface coverage J. Micromech. Microeng. 16 721-30
26. Jacobs H O, Taio A R, Schwartz A, Gracias D H and Whitesides G M 2002 Fabrication of a cylindrical display by patterned assembly Science 296 323-5
27. Fukuta Y, Chapuis Y-A, Mita Y and Fujita H 2006 Design, fabrication and control of MEMS-based actuator arrays for air-flow distributed micromanipulation J. Microelectromech. Syst. 15 212-26
28. Saeedi E, Abbadi S, Böhringer K F and Parvizh B A 2006 Molten-alloy driven self-assembly for nano and micro scale system integartion FDMP 2 221-45
29. Gracias H, Tien J, Breen T L, Hsu C and Whitesides G M 2000 Forming electrical networks in three dimensions by self-assembly Science 289 1170-2
30. Koyanagi M, Fukushima T and Tanaka T 2008 Three-dimensional integration technology using self-assembly technique and super-chip integration Proc. IEEE Int. Interconnect Technology Conf. 2008 (Burlingame, CA, USA) pp 10-2
31. Doms M, Feindt H, Kuipers W J, Shewtanasoontorn D, Matar A S, Brinkhues S, Welton R H and Mueller J 2008 Hydrophobic coating for MEMS applications J. Micromech. Microeng. 18 055030
32. Chapuis Y A, Debray A and Fujita H 2007 3-D large-scale IC/MEMS co-integration using liquid solder for flip-chip assembly Proc. 8th Int. Conf. on Electronics Packaging Technology 2007 (ICEPT'07) pp 88-92
33. Debray A, Chapuis Y A and Fujita H 2006 Fluidic self-alignment applied to a micro-fluidic system IEICE Electron. Express 3 227-32
34. 3 J. Vac. Sci. Technol. A 12 323-32
35. 2 in inductively coupled fluorocarbon plasma: correlation between species and surface etchning J. Vac. Sci. Technol. A 23 226-33
36. Fujimoto K, Kim J M and Nakata S 2001 Self-alignment process using liquid resin for assembly of electronic or optoelectronic devices IEICE Trans. Electron. E84-C 1967-73
37. Fukushima T, Yamada Y, Kikuchi H, Tanaka T and Koyanagi M 2007 Self-assembly process for chip-to-wafer three-dimensional integration Proc. 57th Electronic Components and Technology Conf. 2007 (ECTC'07) pp 836-41
38. Tsai C G, Hsieh C M and Yeh J A 2007 Self-alignment of microchips using surface tension and solid edge Sensors Actuators A 139 343-9
39. Martin B R, Furnange D C, Jackson T N, Mallouk T E and Mayer T S 2001 Self-alignment of patterned wafers using capillary forces at a water-air interface Adv. Funct. Mater. 11 381-6
40. Sato K, Ito K, Hata S and Shimokohbe A 2003 Self-alignment of microparts using liquid surface tension-behavior of micropart and alignment characteristics Precis. Eng. 27 42-50