A survey of cross-layer power-reliability tradeoffs in multi and many core systems-on-chip

Microprocessors and Microsystems

Volumn 37, Issue 8 PARTA, 2013, Pages 760-771

  Eltawil, Ahmed A ^a   Engel, Michael ^b   Geuskens, Bibiche ^c   Djahromi, Amin Khajeh ^c   Kurdahi, Fadi J ^a   Marwedel, Peter ^b   Niar, Smail ^d   Saghir, Mazen A R ^e  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b TU DORTMUND UNIVERSITY   (Germany)

^c INTEL CORPORATION   (United States)

^d UNIVERSITÉ DE VALENCIENNES   (France)

^e TEXAS A AND M UNIVERSITY AT QATAR   (Qatar)

Author keywords

Cross layer; Many core; Multi core; Performance; Power; Reliability

Indexed keywords

SURVEYS; SYSTEM-ON-CHIP;

CROSS LAYER; MANY CORE; MULTI CORE; PERFORMANCE; POWER;

RELIABILITY;

EID: 84888307072     PISSN: 01419331     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.micpro.2013.07.008     Document Type: Article

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