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Volumn 9, Issue 8, 2012, Pages 761-771

Plasma-enhanced chemical vapor deposition of aluminum oxide using ultrashort precursor injection pulses

Author keywords

modulated discharges; plasma enhanced chemical vapor deposition (PECVD); process control; surface passivation; thin films

Indexed keywords

ALUMINUM OXIDE THIN FILMS; ALUMINUM OXIDES; ATOMIC LAYER DEPOSITED; DEPOSITION PROCESS; FILM GROWTH MECHANISM; FILM PROPERTIES; HIGH QUALITY; IMPURITY CONTENT; IN-SITU; INTERFACE QUALITY; MATERIAL PROPERTY; OPTIMIZED PROCESS; PLASMA-SURFACE INTERACTIONS; PRECURSOR FLOW; PRECURSOR INJECTION; SURFACE PASSIVATION; SURFACE RECOMBINATION VELOCITIES; TIME INTERVAL; UNIQUE FEATURES;

EID: 84864866310     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.201100196     Document Type: Article
Times cited : (21)

References (63)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.