SCOPUS 정보 검색 플랫폼

Nanoscale

Volumn 3, Issue 4, 2011, Pages 1434-1445

Preparation of ideal molecular junctions: Depositing non-invasive gold contacts on molecularly modified silicon

(3) Popoff, Richard T W a Kavanagh, Karen L a Yu, Hua Zhong a

a SIMON FRASER UNIVERSITY (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COVALENTLY BONDED; DESIGN TECHNIQUE; DIRECT DEPOSITION; EVAPORATION METHOD; EXPERIMENTAL APPROACHES; FLIP CHIP; GOLD CONTACTS; JUNCTION STRUCTURE; LIFTOFF TECHNIQUE; MODIFIED POLYMER; MOLECULAR JUNCTION; MOLECULAR MONOLAYER; NON-INVASIVE; PRE-DEPOSITION; REPRODUCIBILITIES; SILICON DIODES; SILICON SURFACES;

DIODES; DISTILLATION; ELECTRON ENERGY LEVELS; GOLD; GOLD DEPOSITS; MONOLAYERS; SEMICONDUCTING SILICON COMPOUNDS;

GOLD COATINGS;

GOLD; NANOMATERIAL; SILICON;

CHEMISTRY; EQUIPMENT; EQUIPMENT DESIGN; MICROELECTRODE; REVIEW; ULTRASTRUCTURE;

EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; GOLD; MICROELECTRODES; NANOSTRUCTURES; SILICON;

EID: 79953755918 PISSN: 20403364 EISSN: 20403372 Source Type: Journal
DOI: 10.1039/c0nr00677g Document Type: Review

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.