Viscoplastic creep response and microstructure of as-fabricated microscale Sn-3.0Ag-0.5Cu solder interconnects

Journal of Electronic Materials

Volumn 39, Issue 10, 2010, Pages 2292-2309

  Cuddalorepatta, Gayatri ^a   Williams, Maureen ^b   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

Creep; Grains; Lead free solder; Primary creep; Recrystallization; Secondary creep; Viscoplastic

Indexed keywords

GRAINS; LEAD-FREE SOLDER; PRIMARY CREEP; RECRYSTALLIZATIONS; SECONDARY CREEP; VISCOPLASTIC;

CREEP; CREEP RESISTANCE; EUTECTICS; FABRICATION; GRAIN BOUNDARIES; LEAD; MICROELECTRONICS; MICROSTRUCTURE; RECRYSTALLIZATION (METALLURGY); SILVER; SOLDERED JOINTS; SOLDERING ALLOYS;

TIN;

EID: 78149407228     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1296-z     Document Type: Article

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