Anomalous creep in Sn-rich solder joints

Materials Transactions

Volumn 43, Issue 8, 2002, Pages 1847-1853

  Song, Ho Geon ^a   Morris Jr , John W ^a   Hua, Fay ^a  

^a Lawrence Berkeley National Laboratory   (United States)

Author keywords

Creep behavior; Lead free solder joints; Tin rich solder alloy

Indexed keywords

CREEP; LEAD; STRESS ANALYSIS; THERMAL EFFECTS; TIN ALLOYS;

MELTING POINTS;

SOLDERED JOINTS;

EID: 0036698732     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1847     Document Type: Article

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