Dynamic recrystallization (DRX) as the mechanism for Sn whisker development. Part I: A model

Journal of Electronic Materials

Volumn 38, Issue 9, 2009, Pages 1815-1825

  Vianco, P T ^a   Rejent, J A ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Dynamic recrystallization; Tin whisker growth

Indexed keywords

CRITICAL STEPS; DEFORMATION PROCESS; DEFORMATION STRAIN; DEFORMATION STRUCTURE; DIFFUSION MECHANISMS; ENGINEERING APPLICATIONS; MASS TRANSPORT; MATERIAL SURFACE; METALS AND ALLOYS; RATE KINETICS; SN WHISKER; TIN WHISKER GROWTH; ULTRA-FAST; WHISKER GROWTH;

CRYSTAL WHISKERS; DEFORMATION; GRAIN GROWTH; METALLURGY; STRAIN RATE; TIN;

DYNAMIC RECRYSTALLIZATION;

EID: 68949150789     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0879-z     Document Type: Article

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