Thermal cycling aging effect on the shear strength, microstructure, intermetallic compounds (IMC) and crack initiation and propagation of reflow soldered Sn-3.8Ag-0.7Cu and wave soldered Sn-3.5Ag ceramic chip components

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 2 SPEC. ISS., 2008, Pages 331-344

  Andersson, Cristina ^a   Tegehall, Per Erik ^b   Andersson, Dag R ^b   Wetter, Göran ^b   Liu, Johan ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SWEREA IVF   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

Author keywords

Crack initiation; Crack propagation; Intermetallic compound (IMC); Microstructure; Shear force; Thermal cycling

Indexed keywords

CERAMIC CHIP COMPONENTS; COMPONENT SIZES; CRACK INITIATION AND PROPAGATION; CYCLE NUMBERS; DIFFUSION MECHANISMS; ELECTRONIC COMPONENTS; IMC LAYERS; INTERMETALLIC COMPOUND (IMC); INTERMETALLIC PARTICLES; LAYER THICKNESS; MANUFACTURING PROCESS; MICRO-STRUCTURAL CHANGES; MICROSTRUCTURAL COARSENING; PROPAGATION RATES; SHEAR FORCE; SHEAR FORCE MEASUREMENTS; SN-3.5 AG ALLOYS; SN-3.8AG-0.7CU SOLDERS; SOLDER JOINTS; SURFACE MOUNT DEVICES; TEMPERATURE CYCLING; TEMPERATURE PROFILES; TEST CONDITIONS; TEST ENVIRONMENTS; TESTING CONDITIONS; THERMAL CYCLING AGING; WAVE SOLDERING;

ALLOYS; BRAZING; COPPER ALLOYS; CRACK INITIATION; CRACK PROPAGATION; CRACKS; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; FORCE MEASUREMENT; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRESS CORROSION CRACKING; THERMAL CYCLING; TIN ALLOYS; WELDING;

TIN;

EID: 65349152719     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.916793     Document Type: Conference Paper

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