A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloys

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 132-139

  Ohguchi, Ken Ichi ^a   Sasaki, Katsuhiko ^b   Ishibashi, Masahiro ^c  

^a AKITA UNIVERSITY   (Japan)

^b HOKKAIDO UNIVERSITY   (Japan)

^c NEC CORPORATION   (Japan)

Author keywords

Creep; Elasto plastic creep constitutive model; Lead containing solder alloy; Lead free solder alloy; Strain rate effect; Stress relaxation; Time dependent deformation; Time independent deformation

Indexed keywords

ELASTO-PLASTIC-CREEP CONSTITUTIVE MODEL; LEAD-CONTAINING SOLDER ALLOY; LEAD-FREE SOLDER ALLOY; STRAIN RATE EFFECT; TIME-DEPENDENT DEFORMATION; TIME-INDEPENDENT DEFORMATION;

CREEP; LEAD; PLASTIC DEFORMATION; PLASTICITY; STRESS RELAXATION;

SOLDERING ALLOYS;

EID: 32644446388     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0195-9     Document Type: Conference Paper

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