The twinning phenomenon in SnAgCu solder balls

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1027-1036

  Mueller, Maik ^a   Wiese, Steffen ^b   Wolter, Klaus Juergen ^b  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-DIMENSIONAL; ABRUPT CHANGE; AS-CAST; COOLING RATES; ELECTRON BACK SCATTER DIFFRACTION; FINE GRAINS; GRAIN ORIENTATION; GRAIN STRUCTURES; INDIVIDUAL FACTORS; LARGE-GRAIN; METALLIZATION SYSTEMS; METALLIZATIONS; MISORIENTATION ANGLE; ORIENTATION IMAGING MICROSCOPY; SMALL GRAINS; SNAGCU SOLDER; SOLDER ALLOYS; SOLDER BALLS; SOLDER JOINTS; SOLDER VOLUME;

COOLING; CRYSTAL MICROSTRUCTURE; CRYSTALLIZATION; ELECTRON DIFFRACTION; GRAIN SIZE AND SHAPE; METALLIZING; SOLIDIFICATION;

EXPERIMENTS;

EID: 70349668475     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074138     Document Type: Conference Paper

References (11)

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2. Kang, S.K.; Lauro, P.A.; Shi, D.-Y.; Henderson, D.W.; Gosselin, T.; Sarkhel, A.; Goldsmith, C.; Puttlitz, K.J.: "Ag3Sn Plate Formation in the Solidification of Near- Ternary Eutectic Sn-Ag-Cu" Journal of Metals, Vol. 55, No. 6 (2006), pp. 61-65.
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