In Situ optical creep observation of joint-scale tin-silver-copper solder shear samples

Journal of Electronic Materials

Volumn 38, Issue 10, 2009, Pages 2085-2095

  Herkommer, Dominik ^a   Reid, Michael ^a   Punch, Jeff ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

Creep; Creep mechanisms; In situ optical observation; SAC305 solder

Indexed keywords

CAMERA SYSTEMS; CREEP BEHAVIORS; CREEP MECHANISMS; CREEP TESTS; DEFORMATION MECHANISM; IN SITU OPTICAL OBSERVATION; IN-SITU; LEAD-FREE; OPTICAL OBSERVATIONS; SAC305 SOLDER; SN-3.0AG-0.5CU; SURFACE EFFECT; TEST CONDITION; TIN-SILVER-COPPER SOLDERS;

BRAZING; LEAD; LIGHT TRANSMISSION; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; TESTING; TIN; WELDING;

CREEP;

EID: 69049105264     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0885-1     Document Type: Article

References (34)

1. R Ciocci M Pecht 2006 Solder. Surf. Mt. Tech. 18 14
2. M Reid J Punch M Collins C Ryan 2008 Solder. Surf. Mt. Tech. 20 3
3. R. Coyle, M. Reid, J. Osenbach, C. Ryan, R.P.D. Fleming, R.? Popowitch, H. McCormick, J. Punch, M. Collins, T. Koshmeider, J. Manock, S. Kummerl, and I. Chatterji, J. Electron. Mater. (2009).
4. O Salmela 2007 IEEE Trans. Compon. Packag. Technol. 30 700
5. A. Schubert, R. Dudek, E. Auerswald, A. Gollhardt, B. Michel, and H. Reichl, Elec. Comp. C. (2003), pp. 603-610.
6. B. Rodgers, J. Punch, B. Flood, and F. Waldron, EuroSimE 2005 (2005), pp. 1263-1270.
7. C. Xu, C. Gang, and M. Sakane, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2004, ITHERM 04 (2004), pp. 447-452.
8. Z.N. Cheng, G.Z. Wang, L. Chen, J. Wilde, and K. Becker, Solder. Surf. Mt. Tech. 12, 31 (2000).
9. M. Pei and J. Qu, Int. Symp. Adv. Pkg. Mater. (2005), pp. 45-49.
10. S Wiese K-J Wolter 2004 Microelectron. Reliab. 44 1923
11. RS Sidhu N Chawla 2008 Metall. Mater. Trans. A 39 340
12. XQ Shi ZP Wang QJ Yang HLJ Pang 2003 J. Eng. Mater. Trans. ASME 125 81
13. SW Shin J Yu 2003 Jpn. J. Appl. Phys. 42 1368
14. R. Dudek, W. Faust, J. Vogel, and B. Michel, Proc. EPTC (2004), pp. 396-403.
15. S Park R Dhakal L Lehman E Cotts 2007 Acta Mater. 55 3253
16. D. Herkommer, M. Reid, and J. Punch, EuroSimE. 2008 (2008), pp. 635-642.
17. N Iosipescu 1967 J. Mater. 2 537
18. G. Cuddalorepatta, D. Herkommer, and A. Dasgupta, International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-systems, 2007, EuroSime 2007 (2007).
19. P. Haswell, Durability Assessment and Microstructural Observations of Selected Solder Alloys (College Park: University of Maryland, 2001).
20. D. Herkommer, Investigation of Creep Properties for SAC Solder and Implementation into FEA Simulations (College Park: University of Maryland, 2006).
21. T Reinikainen M Poech M Krumm J Kivilahti 1998 J. Electron. Packag. 120 105
22. D Li C Liu P Conway 2005 Mater. Sci. Eng. 391 95
23. J Pang T Low B Xiong X Luhua C Neo 2004 Thin Solid Films 462-463 370
24. D. Herkommer, M. Reid, and J. Punch, Proc. SMTAI. 2008 (2008), pp. 554-562.
25. D. Herkommer, M. Reid, and J. Punch, Proc. EPTC. 2008 (2008), pp. 506-515.
26. D. Herkommer, M. Reid, and J. Punch, IEEE Trans. Compon. Packag. Technol. (2009).
27. J.J. Sundelin, S.T. Nurmi, and T.K. Lepistö, Mater. Sci. Eng. 474, 201 (2008).
28. T-MK Korhonen LP Lehman MA Korhonen DW Henderson 36 J. Electron. Mater. 36 173
29. DG Morris DR Harries 1977 J. Mater. Sci. 12 1587
30. R.E. Smallman and R.J. Bishop, Modern Physical Metallurgy and Materials Engineering, 6th ed., Chapter 7.9.2 (Heinemann: Butterworth, 1999).
31. Y Wei AF Bower H Gao 2008 Acta Mater. 56 1741
32. RS Sidhu X Deng N Chawla 2008 Metall. Mater. Trans. A 39 349
33. F.R. Mehl, Metals Handbook: Atlas of microstructure of Industrial Alloys, ed. A.L. Willey (Metals Park, Ohio: American Society for Metals, 1972)
34. G. Cuddalorepatta and A. Dasgupta, EuroSimE 2008 (2008), pp. 121-128.