Pb-free solder: New materials considerations for microelectronics processing

MRS Bulletin

Volumn 32, Issue 4, 2007, Pages 360-365

  Borgesen, Peter ^b   Bieler, Thomas ^a   Lehman, L P ^d   Cotts, E J ^c,d  

^a Michigan State University   (United States)

^b Area Array Consortium   (United States)

^c Lehigh Universiry   (United States)

^d BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; LEAD; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SOLIDIFICATION; TIN ALLOYS;

ELECTRONIC DEVICES; LEAD-FREE ALLOYS; MECHANICAL RESPONSE;

MICROELECTRONICS;

EID: 34248203639     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2007.236     Document Type: Article

References (48)

1. K.J. Puttlitz, K.A. Stalter, Eds. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Marcel Dekker, New York, 2004), and related Internet links: IPC Compliance Web Site, http://leadfree.ipc.org/ RoHS_3-2-1-4. asp; EC Environment Policy, Waste Electrical and Electronic Equipment, http://ec.europa.eu/ environment/waste/weee_index.htm; U.K. Department of Trade and Industry Web Site, EC Directive on Waste Electrical and Electronic Equipment, www.dti.gov.uk/innovation/ sustainability/weee/page30269. html; Grace Compliance Specialist Web Site, www.graspllc.com/China%20RoHS.php/.
2. K.W. Moon et al., J. Electron, Mater. 29, 1122 (2000).
3. J.-P. Clech, MicroMater. Nanomater. 3, 144 (2004).
4. R. Darveaux, K. Banerji, A. Mawer, G. Dody, in Ball Grid Array Technology, J.H. Lau, ed. (McGraw-Hill, New York, 1995) pp. 379-442.
5. L.P. Lehman et al., J. Electron. Mater. 33 (12), 1429 (2004).
6. A.U. Telang, T.R. Bieler, JOM 57, 44 (2005).
7. A.U. Telang, T.R. Bieler, S. Choi, K.N. Subramanian, J. Mater. Res. 17, 2204 (2002).
8. D.R. Frear, J. Met. 48, 49 (1996).
9. D.G. House, E.V. Vernon, Br. J. Appl. Phys. 11, 254 (1960).
10. J.A. Rayne, B.S. Chandrasekhar, Phys. Rev. 120, 1658 (1960).
11. K.N. Subramanian, J.G. Lee, J. Mater. Sci-Mater. Electron. 15, 235 (2004).
12. S.B. Park, R. Dhakal, L.P. Lehman, E.J. Cotts, in Proc. ASME InterPACK (San Francisco, CA, 2005).
13. D.R. Frear, J.W. Jang, J.K. Lin, C. Zhang, J. Met. 53, 28 (2001).
14. D.W. Henderson et al., J. Mater. Res. 19 (6), 1608 (2004).
15. Special Issue on Lead-Free Solders and Processing Issues in Microelectronics Packaging, J. Electron. Mater. 32, 1359 (2003).
16. K. Zeng, K.N. Tu, Mater. Sci. Eng. R 38, 55 (2002).
17. A. Zribi et al., J. Electron. Mater. 30, 1157 (2001).
18. M.A. Matin, E.W.C. Coenen, W.P. Vellinga, M.G.D. Geers, Scripte Mater. 53, 927 (2005).
19. T.R. Bieler et al., Proc. 56th Electronic Components Technology Conf. (2006) p. 6.
20. L.P. Lehman et al., Proc. 55th Electronic Components Technology Conf. (2005) p. 674-681.
21. W.C. Luoa et al., Mater. Sci. Eng. A 396, 385 (2005).
22. K. Kim, K. Suganuma, J. Kim, C. Hwang, J. Met. 56, 39 (2004).
23. A.U. Telang et al., J. Electron. Mater. 33 (12), 1412 (2004).
24. F. Ochoa, X. Deng, N. Chawla, J. Electron. Mater. 33 (12), 1596 (2004).
25. K.P. Wu, N. Wade, S. Yamada, K. Miyahara, Z. Metallkd. 95 (3), 185 (2004).
26. Q. Xiao, L. Nguyen, W.D Armstrong, Proc. 54th Electronic Components Technology Conf. (2004) p. 1325-1332.
27. R.L.J.M. Ubachs, P.J.G. Schreurs, M.G.D. Geers, IEEE Trans, Components Packaging Technologies 27 (4), 635 (2004).
28. S. Jadhav, T.R. Bieler, K.N. Subramanian, J.P. Lucas, J. Electron. Mater. 30, 1197 (2001).
29. S. Choi et al., J. Met. 53, 22 (2001).
30. A.U. Telang, T.R. Bieler, M.A. Crimp, Mater. Sci. Eng. A 421 (1-2), 22 (2006).
31. J. Weertman, Trans. Am. Inst. Min. Eng. 218, 207 (1960).
32. M.D. Mathew, Y. Hang, S. Movva, K.L. Murty, Metall. Mater. Trans. 01.36A (1), 99 (2005).
33. R. Kinyanjui, L.P. Lehman, L. Zavalij, E. Cotts, J. Mater. Res. 20, 2914 (2005).
34. K.S. Kim, S.U. Huh, K. Suganuma, J. Alloys Compd. 352, 226 (2002).
35. F. Ochoa, X. Deng, N. Chawla, J. Electron. Mater. 33 (12), 1596 (2004).
36. K.P. Wu, N. Wade, S. Yamada, K. Miyahara, Z. Metallkd. 95 (3), 185 (2004).
37. I. Dutta, D. Pan, R.A. Marks, S.G. Jadhav, Mater. Sci. Eng. A 410-11, 48 (2005).
38. S.K. Kang et al., in Proc. 54th Electronic Components Technology Conf. (2004) p. 661-667.
39. J.G. Lee, K.N. Subramanian, Soldering Surf. Mount Technol. 17 (1), 33 (2005).
40. S.K. Kang et al., J. Electron. Mater. 35 479 (2006).
41. I.E. Anderson, J.L. Harringa, J. Electron. Mater. 33, 1485 (2004).
42. J.C. Gong, C.Q. Liu, P.P. Conway, W. Silberschmidt) Mater. Sci. Eng. A 427 (1-2), 60 (2006).
43. R. Darveaux, K. Banerji, IEEE Trans. Components, Hybrids, Manuf. Technol., 15 (6), 1013 (December 1992).
44. Y. Wei et al., J. Electron. Packaging 126 367 (2004).
45. J. Gong, C. Liu, P.P. Conway, V.V. Silberschmidt, Comput. Mater, Sci. (2007) in press, www.sciencedirect.com.
46. H. Rhee, K.M. Subramanian, Soldering Surf. Mount Technol., 18 (1), 19 (2006).
47. C. Kanchanornai, Y. Miyashita, Y. Mutoh, S.L. Mannan, Mater. Sci. Eng. A 345 90 (2003).
48. S. Terashima, K. Takahama, M. Nozaki, M. Tanaka, Mater. Trans. JIM 45 (4), 1383 (2004).