Large-scale correlations in the orientation of grains in lead-free solder joints

Journal of Electronic Materials

Volumn 37, Issue 10, 2008, Pages 1618-1623

  Sylvestre, Julien ^a   Blander, Alexandre ^a  

^a IBM   (United States)

Author keywords

Grain size; Lead free; Microstructure; Plastic creep; Sn Ag Cu; Solder joints; Twinned grain boundaries

Indexed keywords

COINCIDENT SITE LATTICE BOUNDARIES; CREEP DEFORMATIONS; CREEP PROPERTIES; ELECTRON BACK-SCATTER DIFFRACTION; FLIP CHIPPING; GRAIN SIZE; GRAIN SIZES; INDIRECT MEASUREMENTS; LARGE-SCALE CORRELATIONS; LEAD-FREE; LEAD-FREE SOLDER JOINTS; MICRO-ELECTRONIC PACKAGING; MICROELECTRONIC INDUSTRY; MICROSTRUCTURE; PLASTIC CREEP; SILVER CONTENT; SN-AG-CU; SOLDER JOINTS; STATISTICAL DISTRIBUTIONS; TEMPERATURE CONDITIONS; TWINNED GRAIN BOUNDARIES;

BRAZING; COPPER; CREEP; ELECTRON DIFFRACTION; ELECTRONICS INDUSTRY; GRAIN (AGRICULTURAL PRODUCT); LEAD; MICROELECTRONICS; SILVER; SOLDERING ALLOYS; STRAIN RATE; TIN ALLOYS; WELDING;

TIN;

EID: 51849157741     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0509-1     Document Type: Article

References (19)

1. F. Yang and J.C.M. Li, J. Mater. Sci. Mater. Electron. 18, 191 (2007)
2. D.W. Henderson 2004 J. Mater. Res. 19 1608 doi:10.1557/JMR.2004.0222
3. K.S. Kim S.H. Huh K. Suganuma 2002 Mater. Sci. Eng. A 333 106 doi:10.1016/S0921-5093(01)01828-7
4. S. Wiese et al., IEEE Proceedings of the 57th Electronic Components and Technology Conference (ECTC'07) (2007), pp. 548-557
5. T.-M.K. Korhonen 2004 J. Electron. Mater. 33 1581 doi:10.1007/s11664-004- 0101-2
6. J.A. Rayne B.S. Chandrasekhar 1960 Phys. Rev. 120 1658 doi:10.1103/PhysRev.120.1658
7. A.U. Telang T.R. Bieler D.E. Mason K.N. Subramanian 2003 J. Electron. Mater. 32 1455 doi:10.1007/s11664-003-0115-1
8. C. Odegard et al., IEEE Proceedings of the 55th Electronic Components and Technology Conference (ECTC'05) (2005), pp. 1163-1171
9. M. Uchida et al., IEEE Proceedings of the 57th Electronic Components and Technology Conference (ECTC'07) (2007), pp. 885-891
10. J. Sylvestre, A. Blander, V. Oberson, E. Perfecto, and K. Srivastava, IEEE Proceedings of the 58th Electronic Components and Technology Conference (ECTC'08) (2008)
11. R. Darveaux 2002 Trans. ASME J. Electron. Packag. 124 147
12. J.G. Lee A. Telang K.N. Subramanian T.R. Bieler 2002 J. Electron. Mater 31 1152 doi:10.1007/s11664-002-0004-z
13. J.O. Suh et al., IEEE Proceedings of the 56th Electronic Components and Technology Conference (ECTC'06) (2006), 4 pp
14. T.R. Bieler et al., IEEE Proceedings of the 56th Electronic Components and Technology Conference (ECTC'06) (2006), pp. 1462-1467
15. L.P. Lehman 2004 J. Electron. Mater. 33 1429 doi:10.1007/s11664-004-0083- 0
16. A.U. Telang T.R. Bieler 2005 J. Electron. Mater. 57 44
17. S. Yi G.X. Luo K.S. Chian 2002 J. Electron. Packag. 124 91 doi:10.1115/1.1451845
18. P.P. Jud G. Grossman U. Sennhauser P.J. Uggowitzer 2005 J. Electron. Mater. 34 1206
19. G. Wirmark J.-O. Nilsson G.L. Dunlop 1981 Philos. Mag. A 1 93 doi:10.1080/01418618108239395