Viscoplastic behavior of hypo-eutectic Sn3.0Ag0.5Cu PB-Free alloy under creep loading conditions

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 5, Issue , 2007, Pages 159-167

  Cuddalorepatta, Gayatri ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURVE FITTING; FINITE ELEMENT METHOD; LEAD-FREE SOLDERS; STRESS RELAXATION;

CONSTANT STRESS; CREEP DEFORMATIONS; LOADING CONDITION; MECHANICAL SHEAR; ROOM AND HIGH TEMPERATURES; SECONDARY CREEP; STRESS RELAXATION BEHAVIOR; THERMO-MECHANICAL;

CREEP;

EID: 78149416558     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE200743497     Document Type: Conference Paper

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