Scanning electron microscope in-situ investigation of fracture behavior in 96.5Sn3.5Ag lead-free solder

Journal of Electronic Materials

Volumn 34, Issue 10, 2005, Pages 1324-1335

  Ding, Ying ^a   Wang, Chunqing ^a   Mingyu, L I ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

96.5Sn3.5Ag eutectic solder; Ag3Sn; Deformation behavior; In situ scanning electron microscope (SEM); Tensile rate

Indexed keywords

CRACKS; EUTECTICS; GRAIN BOUNDARIES; INTERMETALLICS; PLASTIC DEFORMATION; SCANNING ELECTRON MICROSCOPY;

EUTECTIC SOLDER; INTERPHASE BOUNDARIES; SN DENDRITES; STRAIN RATES;

FRACTURE;

EID: 27144450954     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0258-3     Document Type: Article

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