Evolution of deformation near the triple point of grain junctions in Sn-based solders during in situ tensile test

Materials Letters

Volumn 59, Issue 6, 2005, Pages 697-700

  Ding, Ying ^a   Wang, Chunqing ^a   Li, Mingyu ^a   Bang, Han Sur ^a,b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Chosun University   (South Korea)

Author keywords

Grain boundary sliding; In situ observation; Sn based solder; Triple point of grain junction

Indexed keywords

AGING OF MATERIALS; ANNEALING; CONSTRAINT THEORY; DEFORMATION; GRAIN BOUNDARIES; TENSILE TESTING; TIN;

GRAIN BOUNDARY SLIDING (GBS); IN SITU OBSERVATIONS; SN-BASED SOLDERS; TRIPLE POINT OF GRAIN JUNCTION;

SOLDERING ALLOYS;

EID: 12244276776     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2004.06.070     Document Type: Article

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