Creep deformation behavior of Sn-3.5Ag solder at small length scales

JOM

Volumn 56, Issue 6, 2004, Pages 50-54

  Kerr, M ^a   Chawla, N ^a  

^a Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; CREEP; DISLOCATIONS (CRYSTALS); FRACTOGRAPHY; METALLOGRAPHIC MICROSTRUCTURE; SILVER COMPOUNDS; STRESS ANALYSIS; SUBSTRATES; THERMAL DIFFUSION; THERMAL EFFECTS; TIN ALLOYS;

COPPER SUBSTRATE; CREEP DEFORMATION; THRESHOLD STRESS ANALYSIS; TIN SILVER SOLDER;

SOLDERING ALLOYS;

EID: 3242767798     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-004-0112-8     Document Type: Article

References (35)

1. S. Kung and A. Sarkhel, JOM, 23 (1994), pp. 701-707.
2. P.T. Vianco and D.R. Frear, JOM, 45 (7) (1993), pp. 14-19.
3. M. Abtew and G. Selvaduray, Mater. Sci. and Eng., 27 (2000), pp. 95-141.
4. I. Shoji et al., Mater. Sci. Eng., 366 (2004), pp. 50-55.
5. H.G. Song, J.W. Morris, Jr., and F. Hua, JOM, 54 (6) (2002), pp. 30-32.
6. J. Glazer, Int. Mat. Rev., 40 (1995), pp. 65-93.
7. S. Choi et al., J. Elec. Mater., 4 (2002), pp. 292-297.
8. F. Ochoa, J.J. Williams, and N. Chawla, JOM, 55 (2002), pp.55-60.
9. R.J. McCabe and M.E. Fine, Metall. Mater. Trans., 33 (2002), pp. 1531-1539.
10. J.E. Breen and J. Weertman, Trans. AIME (New York: AIME, 1955), pp. 1230-1234.
11. M.D. Mathew et al., Creep Behaviors of Advanced Materials for the 21st Century, ed. R.S. Mishra and A.K. Mukherjee (Warrendale, PA: TMS, 1999), pp. 51-59.
12. M.L. Haung, L. Wang, and C.M.L. Wu, J. Mater. Res., 17 (2002), pp. 2897-2903.
13. R. Darveaux and K. Banerji, IEEE T. Compon. Hybr, 15 (1992), pp. 1013-1024.
14. H. Mavoori and S. Jin, J. Elec. Mater., 27 (1998), pp. 1216-1222.
15. W.J. Plumbridge, C.R. Gagg, and S. Peters, J. Elec. Mater., 30 (2001), pp. 1178-1183.
16. F. Ochoa, X. Deng, and N. Chawla, J. Elec. Mater. (submitted in 2004).
17. S. Wiese, F. Feustel, and E. Meusel, Sensors Actuat. A-Phys., 99 (2002), pp. 188-193.
18. J.H. Lau, S.H. Pan, and C. Chang, J. Elec. Packaging, 124 (2002), pp. 69-76.
19. S.G. Jadhav et al., J. Elec. Mater., 30 (2001), pp. 1197-1205.
20. K.C. Chen et al., J. Elec. Mater., 31 (2002), pp. 1181-1189.
21. F.A. Mohamed, K.L. Murty, and J.W. Morris, Jr.. Metall. Trans., 4 (1973), pp. 935-940.
22. S.H. Suh, J.B. Cohen, and J. Weertman, Metall. Trans., 14 (1983), pp. 117-126.
23. MTS Systems Corp., www.mts.com.
24. X. Deng et al., J. Electron. Mater., 32 (12) (2003), pp. 1403-1413.
25. R. Lagneborg and B. Bergman, Met. Sci., 10 (1976), pp. 20-28.
26. F. Garofalo, Fundamentals of Creep and Creep-Rupture in Metals (New York: Macmillan, 1965), pp. 66-73.
27. R.W. Evans and B. Wilshire, Introduction to Creep (London: The Institute of Materials, 1993), pp. 46-47.
28. H. Luthy, A.K. Miller, and O.D. Sherby, Acta Metall., 28 (1980), pp. 169-178.
29. O.A. Ruano, A.K. Miller, and O.D. Sherby, Mater. Sci. Eng., 51 (1981), pp. 9-16.
30. R.A. Stevens and P.E.J. Flewitt, Acta Metall., 29 (1981), pp. 867-882.
31. S. Mitra, Metall. Mater. Trans., 27 (1996), pp. 13-23.
32. M. Kerr and N. Chawla, Acta Mater., submitted in 2004.
33. E.W. Hart, Acta Metall. Mater., 15 (1967), pp. 1545-1549.
34. F.W. Crossman and M.F. Ashby, Acta Metall. Mater., 23 (1975), p. 425.
35. N. Chawla et al., J. Elec. Mater., (submitted in 2004).