Microstructure and mechanical properties predicted by indentation testing of lead-free solders

Journal of Electronic Materials

Volumn 34, Issue 3, 2005, Pages 311-317

  Ogawa, T ^a   Kaga, R ^a   Ohsawa, T ^a  

^a AOYAMA GAKUIN UNIVERSITY   (Japan)

Author keywords

Creep; Elastic; Indentation method; Lead free solder; Mechanical properties; Microstructure; Plastic

Indexed keywords

CREEP; ELASTICITY; EUTECTICS; FINITE ELEMENT METHOD; INDENTATION; LEAD ALLOYS; MICROSTRUCTURE; PLASTIC DEFORMATION; TIN ALLOYS;

CREEP DEFORMATIONS; ELECTRO-MAGNETIC TESTING; INDENTATION METHOD; LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 17244376693     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0218-y     Document Type: Article

References (14)

1. T. Ohsawa, Kougyou Chousakai, p. 26 (1996) (in Japanese).
2. M. Mukai, T. Kawakami, K. Takahashi, K. Kishimoto, and T. Shibuya, Trans. Jpn. Soc. Mech. Eng., Ser. A 63, 1594 (1997) (in Japanese).
3. Q. Yu, Y. Kaga, M. Shiratori, and M. Kifune, Trans. Jpn. Soc. Mech. Eng., Ser. A 67, 216 (2001) (in Japanese).
4. W.D. Nix, Metall. Trans. A 20A, 2217 (1989).
5. M. J. Mayo and W.D. Nix, Proc. 8th Int. Conf. on Strength of Metals and Alloys (Elmsford, NJ: Pergamon Press, 1988), pp. 1415-1420.
6. W.H. Poisl, W.C. Oliver, and B.D. Fabes, J. Mater. Res. 10, 2024 (1995).
7. Akira Miyamoto, Takeshi Ogawa, and Tadashi Ohsawa, Mater. Sci. Res. Int. 9, 6 (2003).
8. T. Ogawa, A. Miyamoto, T. Ohsawa, and K. Ohshimizu, J. Soc. Mater. Sci., Jpn. 49, 666 (2000) (in Japanese).
9. Standard for Tensile Test of Solders, Jpn. Soc. Mater. Sci., ISHS-SD-2-00, p. 19 (2000) (in Japanese).
10. Nihon Superior Co. Ltd., http://www.nihonsuperior.co.jp/ english/products/leadfree/specification.html
11. T. Yebisuya and T. Kawakubo, J. Jpn. Inst. Met., p. 455 (1993) (in Japanese).
12. M.D. Mathew, S. Movva, and K.L. Murty, Key Eng. Mater. 171-174, 655 (2000).
13. H. Takahashi, M. Mukai, and T. Kawakami, Proc. 49th Symp. Jpn. Soc. Mater. Sci., 125 (2000) (in Japanese).
14. M. Takada, M. Sakane, H. Tsukada, and H. Nishimura, Jpn. Soc. Mech. Eng., Ser. A 66, 589 (2000) (in Japanese).