The effect of downscaling the dimensions of solder interconnects on their creep properties

Microelectronics Reliability

Volumn 48, Issue 6, 2008, Pages 843-850

  Wiese, S ^a   Roellig, M ^a   Mueller, M ^a   Wolter, K J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CREEP; IRON; MATHEMATICAL MODELS; SOLDERING ALLOYS; TENSILE TESTING; TESTING; WELDING;

(2+1) DIMENSIONS; BULK SOLDERS; CREEP DATA; CREEP PROPERTIES; DOWN-SCALING; ELECTRONIC ASSEMBLIES; ELSEVIER (CO); FE-ANALYSIS; KEY PROBLEMS; MATERIAL MODELLING; MECHANICAL BEHAVIOURS; SOLDER INTERCONNECTS; SOLDER JOINTS; TENSILE SPECIMENS; TENSILE TESTS; ULTRA-SMALL;

METALS;

EID: 45949093528     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.03.026     Document Type: Article

References (25)

1. Mei Z., Morris Jr. J.W., Shine M.C., and Summers T.S.E. Effects of cooling rate on mechanical properties of near-eutectic tin-lead solder joints. J Electron Mater 20 (1991) 599-608
2. Subrahmanyan RA. Damage integral approach for low cycle and thermal fatigue. Dissertation, Cornell University, Ithaka, 1990.
3. Nir N., Dudderar T.D., Wong C.C., and Storm A.R. Fatigue properties of microelectronics solder joints. Trans ASME 113 (1991) 92-101
4. Wiese S., and Wolter K.J. Creep of thermally aged SnAgCu-solder joints. Microelectron Reliab 47 (2007) 223-232
5. 37Pb flip chip solder joints. In: Belton D.J., Gaynes M., Jacobs E.G., Pearson R., and Wu T. (Eds). Electronic packaging materials science X - MRS symposium proceedings vol. 515 (1998), Materials Research Society, San Francisco, Warrendale 233-238 14-16 April
6. Roellig M., Wiese S., Meier K., and Wolter K.J. Creep measurements of 200-400 μm solder joints. In: Ernst L.J., et al. (Ed). Proceedings of EuroSimE 2007 (2007), IEEE, London, Piscataway, NJ 255-264 April 16-18
7. Roellig M., Dudek R., Wiese S., Boehme B., Wunderle B., Wolter K.J., et al. Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept. Microelectron Reliab 47 (2007) 187-195
8. Wiese S., and Wolter K.J. Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders. Microelectron Reliab 44 (2004) 1923-1931
9. Mavoori H., et al. Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders. J Electron Mater 26 (1997) 783-790
10. 4Ag and castin alloy. J Electron Packag 123 (2001) 238-246
11. Raeder CH et al. Isothermal creep of eutectic SnBi and SnAg solder and solder joints. In: Proceedings of 1994 IEEE/CPMT international, Electronics manufacturing technology symposium 1994. Piscataway, NJ: IEEE; 1994. p. 1-6.
12. Wu K., Wade N., Cui J., and Miyahara K. Microstructural effect on the creep strength of a Sn-3.5%Ag solder alloy. J Electron Mater 32 (2003) 5-8
13. 3.5Ag solder. Mater Charact 54 (2005) 223-229
14. Shohji I., Yoshida T., Takahashi T., and Hioki S. Tensile properties of Sn-Ag based lead free solders and strain rate sensitivity. Mater Sci Engng A366 (2004) 50-55
15. Plumbridge W.J., and Gagg C.R. Effects of strain rate and temperature on the stress-strain response of solder alloys. J Mater Sci: Mater Electron 10 (1999) 461-468
16. 0.5Ag solder joints. J Electron Packag 117 (1995) 100-104
17. 3.5Ag solder/Cu couple at small length scales. Acta Mater 52 (2004) 4527-4535
18. Morris Jr JW, Song HG, Hua F. Creep properties of Sn-rich solder joints. In: Proceedings of the IEEE 53rd electronics components and technology conference, New Orleans, 27-30 May, 2003. Piscataway, NJ: IEEE; 2003. p. 54-7.
19. 3.5Ag alloy. J Electron Mater 33 (2004) 1596-1607
20. 3.5Ag solders. Mater Sci Engng A 379 (2004) 401-410
21. Whitelaw R.S., Neu R.W., and Scott D.T. Deformation behavior of two lead-free solders: indalloy 227 and castin alloy. J Electron Packag 121 (1999) 99-107
22. Roellig M, Wiese S, Wolter KJ. Extraction of material parameters for creep experiments on real solder joints by FE-analysis. In: Proceedings of the EuroSimE conference 2006, Como (I), 24-26 April, 2006. Piscataway, NJ: IEEE; 2006. p. 281-9.
23. Wiese S., and Meusel E. Characterization of lead-free solders in flip chip joints. J Electron Packag 125 (2003) 531-538
24. Wiese S., and Rzepka S. Time-independent elastic-plastic behaviour of solder materials. Microelectron Reliab 44 (2004) 1893-1900
25. Mueller M, Wiese S, Roellig M, Wolter, KJ. The dependence of composition, cooling rate and size on the solidification behaviour of SnAgCu solders. In: Proceedings of EuroSimE 2007, 16-18 April, 2007. London, Piscataway, NJ: IEEE; 2007. p. 446-55.