Effect of geometry and temperature cycle on the reliability of WLCSP solder joints

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 441-448

  Chaparala, Satish C ^a   Roggeman, Brian D ^a   Pitarresi, James M ^a   Sammakia, Bahgat G ^a   Jackson, John ^b   Griffin, Garry ^b   McHugh, Tom ^b  

^a State University of New York   (United States)

^b ANALOG DEVICES INC   (United States)

Author keywords

Darveaux model; Finite element analysis; Micro CSP; Solder joint reliability

Indexed keywords

FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY; SOLDERING ALLOYS; THERMAL CYCLING;

DARVEUX MODEL; SOLDER JOINT RELIABILITY; WAFER LEVEL CHIP SCALE PACKAGES (WLCSP);

CHIP SCALE PACKAGES;

EID: 27644561988     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.853589     Document Type: Article

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