Oxidation study of pure tin and its alloys via electrochemical reduction analysis

Journal of Electronic Materials

Volumn 34, Issue 5, 2005, Pages 635-642

  Cho, Sungil ^a   Yu, Jin ^a   Kang, Sung K ^b   Shih, Da Yuan ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Electrochemical reduction analysis; Oxidation; Sn alloys; Solder

Indexed keywords

ELECTROCHEMISTRY; ELECTROLYTIC REDUCTION; GIBBS FREE ENERGY; MICROELECTRONICS; OXIDATION; SOLDERING ALLOYS; THERMAL EFFECTS; THERMODYNAMICS; TIN ALLOYS; VACUUM; X RAY PHOTOELECTRON SPECTROSCOPY;

DENDRITES; ELECTROCHEMICAL REDUCTION ANALYSIS; MECHANICAL RELIABILITY; PLATEAUS;

TIN;

EID: 20344377969     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0077-6     Document Type: Conference Paper

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