Microstructure and damage evolution in Sn-Ag-Cu solder joints

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 674-681

  Lehman, L P ^a   Kinyanjui, R K ^a   Wang, J ^a   Xing, Y ^a   Zavalij, L ^a   Borgesen, P ^b   Cotts, E J ^a  

^a BINGHAMTON UNIVERSITY   (United States)

^b UNIVERSAL INSTRUMENTS CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; DAMAGE EVOLUTION; SN GRAINS; SOLDER MICROSTRUCTURE;

ARRAYS; CHIP SCALE PACKAGES; COPPER; INTERMETALLICS; MICROSTRUCTURE; SILVER; TIN ALLOYS;

SOLDERED JOINTS;

EID: 22944465234     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

1. Borgesen, P., and Henderson, D. W., "Fragility of Pb-free solder joints", white paper, Aug. 24, 2004, www.uic.com
2. Chiu, C., Zeng, K., Stierman, R. Edwards, D., and Ano, K., "Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages", 54th ECTC Conf., 2004
3. Date, M., Shoji, T., Fujiyoshi, M., Sato, K., and Tu, K. N., "Impact Reliability of Solder Joints", 54th ECTC Conf., 2004
4. Gregorich, T., Holmes. P., Lee, J., and Lee, C., "SnNi and SnNiCu Intermetallic Compounds Found When Using SnAgCu Solders", IPC/Soldertec Global 2nd Int. Conf. on Lead Free Electronics, June 2004
5. Area Array Consortium research, Universal Instruments Corporation, Binghamton, NY
6. Zribi, L. Zavalij, P. Borgesen, and E. J. Cotts, "The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of Microstructure," Symposium Y, Proceedings of the Fall Meeting of the Materials Research Society, Y8.10, Vol. 652 (1999).
7. Cotts, E. J, Chromik, R, Borgesen, P, Kinyanjui, Rand Zribi, A; Formation of Intermetallic Compounds at Pb-Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints", Published in the Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Edited by Puttlitz, K.J and Stalter, K. A, 2004 by Marcel Dekker, Inc.
8. L. P. Lehman, S. N. Athavale, T. Z. Fullem, A.Giamis, R. Kinyanjui, M. Lowenstein, K. Mather, R. Patel, D. Rae, J. Wang, Y. Xing, L. Zavalij, P. Borgesen, E. J. Cotts, "Growth of Sn and Intermetallic Compounds in Sn-Ag-Cu Solder" J. Electronic Materials 33, 1429(2004).
9. R. Kinyanjui, L. P. Lehman, L. Zavalij, E. Cotts "Effect of Sample Size on the Solidification Temperature and Microstructure of SnAgCu near Eutectic Alloys"submitted to Journal of Materials Research.
10. L. P. Lehman, R. K. Kinyanjui, L. Zavalij, A. Zribi, E. J. Cotts, "Growth and Selection of Intermetallic Species in Sn-Ag-Cu No-Pb Solder Systems based on Pad Metallurgies and Thermal Histories", 2003 Electronic Components and Technology Conference, pp1215-1221, May 27-30, 2003, New Orleans LA.
11. Henderson, D. W, Woods, J J, Gosselin, T. A, Bartelo, J, King, D. E, Korhonen, T. M and M. A. Korhonen, M. A, L. P. Lehman, E. J. Cotts, Sung K. Kang, Paul A. Lauro, Da-Yuan Shih, Charles Goldsmith, and Karl J. Puttlitz; "The Microstructure of Sn in Near Eutectic Sn-Ag-Cu Alloy Solder Joints And Its Role In Thermomechanical Fatigue", Journal of Materials Research 19,(2004).
12. 3Sn plate Formation in the Solidification of Near ternary Eutectic Sn-Ag-Cu Alloys" Journal of Materials Research, 2775 (2002).
13. Telang, A. U, Bieler, T.R, Choi, S and Subramanian, K.N; "Orientation Imaging Studies of Sn-Based Electronic Solder Joints", Journal of Materials Research 17, 2294 (2002).
14. Moon, Z. W. Boettinger, W. J, Kitten, U. R. Biancaniello, F. S and Handwerker, C. A, JEM, Vol. 29, No. 10, Pp.1122, 2000
15. and Loomans, M. E and Fine, M. E, Metall. Mater. Trans. A, Phys. Matall. Mater. Sci, Vol. 31A, No.4, Pp.1155, 2000.
16. S. Huh, K. Kim and K. Suganuma, "Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder", Materials Transactions 42, 739(2001).
17. Yoshiharu Kariya, Yasunori Hirata and Masahisa Otsuka & "Mechanical Fatigue Characteristics of Sn3.5AgX (X=Bi, Cu, Zn and In) Solder Alloys, Journal of Electronic Materials 28, 123-1269 (1999)
18. Moore, K.I Zhang, D.L and Cantor, B; "Solidification of Pb Particles Embedded in Al", Acta Metall. Mater. 38, 1327 (1990).
19. D. Turnbull, "Isothermal rate of solidification of small droplets of mercury and tin," Journal of Chemical Physics 18,768 (1950).