Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints

Soldering and Surface Mount Technology

Volumn 17, Issue 1, 2005, Pages 33-39

  Lee, J G ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

Alloys; Fatigue; Joining processes; Solder

Indexed keywords

ALLOYS; CREEP; EUTECTICS; FATIGUE OF MATERIALS; JOINING; MICROSTRUCTURE; SILVER; SOLDERING ALLOYS; TIN;

ELECTRONIC SOLDERS; FATIGUE; JOINING PROCESS; QUATERNARY ALLOYS;

SOLDERED JOINTS;

EID: 18844425254     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510579221     Document Type: Conference Paper

References (21)

1. Choi, S., Lee, J.G., Guo, F., Bieler, T.R., Subramanian, K.N. and Lucas, J.P. (2001), "Creep properties of Sn-Ag solder joints containing intermetallic particles", JOM - Journal of The Minerals, Metals & Materials Society, Vol. 53 No. 6, pp. 22-6.
2. Choi, S., Lee, J.G., Subramanian, K.N., Lucas, J.P. and Bieler, T.R. (2002), "Microstructural characterization of damage in thermomechanically fatigued Sn-Ag based solder joints", Journal of Electronic Materials, Vol. 31 No. 4, pp. 292-7.
3. Chuang, C.M., Shin, P.C. and Lin, K.L. (2004), "Mechanisms for the intermetallic formation during the Sn-20In-2.8Ag/Ni soldering reactions", Journal of Electronic Materials, Vol. 33 No. 1, pp. 374-81.
4. Frear, D.R., Jang, J.W., Lin, J.K. and Zhang, C. (2001), "Pb-free solders for flip-chip interconnects", JOM - Journal of The Minerals, Metals & Materials Society, Vol. 53 No. 6, pp. 28-32, 38.
5. Gibson, A.W., Choi, S., Bieler, T.R. and Subramanian, K.N. (1997), "Environmental concerns and materials issues in manufactured solder joints", Proceedings of the 5th IEEE International Symposium on Electronics and the Environment, San Francisco, CA, pp. 246-51.
6. Guo, F., Choi, S., Lucas, J.P. and Subramanian, K.N. (2002), "Effects of reflow on wettability microstructure and mechanical properties in lead-free solders", Journal of Electronic Materials, Vol. 29 No. 10, pp. 1241-8.
7. Guo, F., Choi, S., Subramanian, K.N., Bieler, T.R., Lucas, J.P., Achari, A. and Paruchuri, M. (2003), "Evaluation of creep behavior of near eutectic Sn-Ag solders containing small amounts of alloy additions", Materials Science and Engineering A, Vol. 351 No. 1-2, pp. 190-9.
8. Humphreys, F.J. and Kalu, P.N. (1987), "Dislocation-particle interactions during high temperature deformation of two-phase aluminium alloys", Acta Metall, Vol. 35 No. 12, pp. 2815-29.
9. Hwang, J.S. and Guo, Z.F. (1993), "Lead free solders for electronic packaging and assembly", Proceedings, Surface Mount International Conference, San Jose, CA Vol. 2 No. 31 pp. 732-47.
10. Jadhav, S.G., Subramanian, K.N., Bieler, T.R. and Lucas, J.P. (2001), "Stress relaxation behavior of composite and eutectic Sn-Ag solder joints", Journal of Electronic Materials, Vol. 30 No. 9, pp. 1197-205.
11. Kang, S.K. and Ference, T.G. (1993), "Nickel-alloyed tin-lead eutectic solder for surface mount technology", Journal of Materials Research, Vol. 8 No. 5, pp. 1033-40.
12. Lee, J.G. and Subramanian, K.N. (2003), "Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag based solder joints", Journal of Electronic Materials, Vol. 32 No. 6, pp. 523-30.
13. Lee, J.G., Guo, F., Choi, S., Subramanian, K.N., Bieler, T.R. and Lucas, J.P. (2002), "Residual mechanical behavior of thermomechanically fatigues Sn-Ag based solder joints", Journal of Electronic Materials, Vol. 31 No. 9, pp. 946-52.
14. McCormack, M. and Jin, S. (1993), "Progress in the design of new lead-free solder alloys", JOM - Journal of The Minerals, Metals & Materials Society, Vol. 45 No. 7, pp. 36-40.
15. Oh, C.S., Shim, J.H., Lee, B.J. and Lee, D.N. (1996), "A thermodynamic study on the Ag-Sb-Sn system", Journal of Alloys and Compounds, Vol. 238 No. 1-2, pp. 155-66.
16. Smith, W.F. (1993), in Gibala, R., Tirrell, M. and Wert, C. (Eds), Structure and Properties of Engineering Alloys, 2nd ed., McGraw-Hill, New York, NY, pp. 498-509.
17. Takao, H. and Hasegawa, H. (2001), "Influence of alloy composition on fillet-lifting phenomenon in Sn-Ag-Bi [tin, silver, bismuth solder] alloys", Journal of Electronic Materials, Vol. 30 No. 9, pp. 1060-7.
18. Vianco, P.T. (1993), "Developments of alternatives to lead-bearing solders", Proceedings, Surface Mount International Conference, San Jose, CA, Vol. 2 No. 31 pp. 725-31.
19. Winterbottom, W.L. (1993), "Converting to lead free solders: an automotive industry perspective", JOM - Journal of The Minerals, Metals & Materials Society, Vol. 45 No. 7, pp. 20-4.
20. Xia, Z.D., Chen, Z.G., Shi, Y.W., Mu, N. and Sun, N. (2002), "Effect of rare-earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder", Journal of Electronic Materials, Vol. 31 No. 6, pp. 564-7.
21. Wu, C.M.L. and Huang, M.L. (2002), "Creep behavior of eutectic Sn-Cu lead-free solder alloy", Journal of Electronic Materials, Vol. 31 No. 5, pp. 442-8.