Interfacial reaction and morphology between molten Sn base solders and Cu substrate

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 646-651

  Takaku, Yoshikazu ^a   Liu, Xing Jun ^a   Ohnuma, Ikuo ^a   Kainuma, Ryosuke ^a   Ishida, Kiyohito ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Growth kinetics; Interfacial reaction; Intermetallic compounds; Lead free solder; Liquid solid diffusion couple; Scallop morphology

Indexed keywords

COPPER; GROWTH KINETICS; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; MOLTEN MATERIALS; MORPHOLOGY; PHASE DIAGRAMS; SOLDERING ALLOYS; SUBSTRATES; THICKNESS MEASUREMENT;

INTERFACIAL REACTION; LEAD-FREE SOLDERS; LIQUID/SOLID DIFFUSION COUPLE; SCALLOP MORPHOLOGY;

TIN;

EID: 2442499428     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.646     Document Type: Article

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