Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1-2 wt-%Cu alloy solder joints due to thermal cycling

Materials Science and Technology

Volumn 19, Issue 10, 2003, Pages 1403-1410

  Kato, H ^a   Matsubara, K ^a,b   Kageyama, K ^a  

^a SAITAMA UNIVERSITY   (Japan)

^b TOKYO GAS CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; HEAT TREATMENT; PLATES (STRUCTURAL COMPONENTS); SOLDERED JOINTS; THERMAL CYCLING;

ISOTHERMAL HEATING;

COPPER ALLOYS;

ALLOY; COPPER; SILVER; TIN;

ARTICLE; CHEMICAL ANALYSIS; CHEMICAL BINDING; CYCLING; HEATING; TEMPERATURE DEPENDENCE;

EID: 0142215420     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708303225006006     Document Type: Article

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