Long term mechanical reliability with lead-free solders

Soldering & Surface Mount Technology

Volumn 16, Issue 2, 2004, Pages 13-20

  Plumbridge, W J ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

Modelling; Reliability; Reliability management; Solders

Indexed keywords

ANISOTROPY; CRYSTAL STRUCTURE; CRYSTALLOGRAPHY; ELASTIC MODULI; FATIGUE OF MATERIALS; JOINTS (STRUCTURAL COMPONENTS); MELTING; METALLURGY; RESIDUAL STRESSES; THERMAL EXPANSION; TIN ALLOYS;

ALLOTROPY; LEAD-FREE ALLOYS; THERMOMECHANICAL FATIGUE (TMF); TWO-PHASE SYSTEMS;

SOLDERING ALLOYS;

EID: 2942580837     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910410537291     Document Type: Article

References (22)

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