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International Journal of Fatigue

Volumn 23, Issue 8, 2001, Pages 723-731

Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder

(3) Zhao, J a Miyashita, Y a Mutoh, Y a

a NAGAOKA UNIVERSITY OF TECHNOLOGY (Japan)

Author keywords

Crack path; Creep effect; Fatigue crack growth; Lead free; Solder; Stress ratio

Indexed keywords

CRACK PROPAGATION; CREEP; EUTECTICS; FATIGUE TESTING; INTERMETALLICS; STRESS ANALYSIS; TIN ALLOYS;

LEAD-FREE SOLDERS;

SOLDERING ALLOYS;

EID: 0035452425 PISSN: 01421123 EISSN: None Source Type: Journal
DOI: 10.1016/S0142-1123(01)00034-2 Document Type: Article

Times cited : (64)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.