Microscopic experimental investigation on shear failure of solder joints

International Journal of Fracture

Volumn 130, Issue 3, 2004, Pages 617-634

  Lau, K J ^a   Tang, C Y ^a   Tse, P C ^a   Chow, C L ^b   Ng, S P ^a   Tsui, C P ^a   Rao, B ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b University of Michigan Dearborn   (United States)

Author keywords

Back face strain; In situ measurements; Microstructures under shear; Solder joint

Indexed keywords

COPPER; CRACKS; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FRACTURE MECHANICS; METALLOGRAPHIC MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SOLDERING ALLOYS; STRAIN MEASUREMENT; STRESS CONCENTRATION; STRIP METAL;

FATIGUE LOADING; LEAD FREE SOLDERS; MICROSTRUCTURES UNDER SHEAR; SHEAR FAILURE; SHEAR LAP JOINT SPECIMEN; SHEAR TEST;

SOLDERED JOINTS;

EID: 12544254952     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10704-004-2311-2     Document Type: Article

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