Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Journal of Electronic Materials

Volumn 32, Issue 3, 2003, Pages 142-151

  Vianco, Paul T ^a   Rejent, Jerome A ^a   Kilgo, Alice C ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Constitutive equation; Elastic modulus; Modeling; Thermal expansion; Thermal mechanical fatigue; Tin silver copper (Sn Ag Cu) solder; Yield stress

Indexed keywords

AGING OF MATERIALS; CRYSTALLIZATION; ELASTIC MODULI; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; MECHANICAL TESTING; STRAIN RATE; TERNARY SYSTEMS; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES; TIN ALLOYS; YIELD STRESS;

COEFFICIENT OF THERMAL EXPANSION; CONSTITUTIVE MODEL; DYNAMIC RECRYSTALLIZATION PROCESSES; TERNARY SOLDER; THERMAL MECHANICAL FATIGUE;

SOLDERING ALLOYS;

EID: 0037350831     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0185-0     Document Type: Article

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