Grain boundary sliding on near-7°, 14°, and 22° special boundaries during thermomechanical cycling in surface-mount lead-free solder joint specimens

Materials Science and Engineering: A

Volumn 421, Issue 1-2, 2006, Pages 22-34

  Telang, A U ^a   Bieler, T R ^a   Crimp, M A ^a  

^a Michigan State University   (United States)

Author keywords

Anisotropy; Dual shear lap; Grain boundary sliding; Lead free solder joint specimens

Indexed keywords

ANISOTROPY; COMPRESSIVE STRESS; GRAIN BOUNDARIES; SHEAR STRESS; SOLIDIFICATION; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION;

DUAL-SHEAR LAP; GRAIN BOUNDARY SLIDING; LEAD-FREE SOLDER JOINT SPECIMENS; ORIENTATION IMAGING MICROSCOPY; THERMOMECHANICAL CYCLING;

SOLDERED JOINTS;

ANISOTROPY; COMPRESSIVE STRESS; GRAIN BOUNDARIES; SHEAR STRESS; SOLDERED JOINTS; SOLIDIFICATION; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION;

EID: 33645995696     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.10.009     Document Type: Article

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