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Volumn 34, Issue 1, 2005, Pages 62-67

Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Author keywords

Cyclic softening; Lead free solder; Low cycle fatigue; Sn 3.8Ag 0.7Cu alloy

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; DEFORMATION; FATIGUE OF MATERIALS; LEAD; MICROCRACKS; SILVER; TIN;

EID: 13244267364     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0181-7     Document Type: Article
Times cited : (25)

References (21)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.