Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure

Journal of Electronic Materials

Volumn 34, Issue 1, 2005, Pages 62-67

  Zeng, Qiu Lian ^a   Wang, Zhong Guang ^a   Xian, A I Ping ^a   Shang, J K ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Cyclic softening; Lead free solder; Low cycle fatigue; Sn 3.8Ag 0.7Cu alloy

Indexed keywords

COPPER; CRYSTAL MICROSTRUCTURE; DEFORMATION; FATIGUE OF MATERIALS; LEAD; MICROCRACKS; SILVER; TIN;

CYCLIC SOFTENING; LEAD-FREE SOLDER; LOW-CYCLE FATIGUE; SN-3.8AG-0.7CU ALLOY;

SOLDERED JOINTS;

EID: 13244267364     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0181-7     Document Type: Article

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