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Volumn 34, Issue 1, 2005, Pages 62-67
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Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure
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Author keywords
Cyclic softening; Lead free solder; Low cycle fatigue; Sn 3.8Ag 0.7Cu alloy
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Indexed keywords
COPPER;
CRYSTAL MICROSTRUCTURE;
DEFORMATION;
FATIGUE OF MATERIALS;
LEAD;
MICROCRACKS;
SILVER;
TIN;
CYCLIC SOFTENING;
LEAD-FREE SOLDER;
LOW-CYCLE FATIGUE;
SN-3.8AG-0.7CU ALLOY;
SOLDERED JOINTS;
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EID: 13244267364
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-005-0181-7 Document Type: Article |
Times cited : (25)
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References (21)
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