Behavior of lead-free solder under thermomechanical loading

Journal of Electronic Packaging

Volumn 126, Issue 3, 2004, Pages 367-373

  Wei, Y ^a   Chow, C L ^a   Lau, K J ^b   Vianco, P ^c   Fang, H E ^c  

^a University of Michigan Dearborn   (United States)

^b HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^c SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER PROGRAM LISTINGS; DEFORMATION; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; LEAD; LOADING; STRAIN RATE; STRESS ANALYSIS; TIN ALLOYS; VISCOPLASTICITY;

DAMAGE MECHANICS; LEAD-FREE SOLDERS; MATERIAL DEGRADATION; THERMOMECHANICAL LOADING;

SOLDERING ALLOYS;

EID: 12344272844     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1773197     Document Type: Article

References (10)

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8. Frear, D. R., Burchett, S. N., Neilsen, M. K., and Stephens, J. J., 1997, "Microstructurally Based Finite Element Simulation of Solder Joint Behavior," Soldering & Surface Mount Technology, 2, pp. 39-42.
9. Wei, Y., and Chow, C. L., 2001, "A Damage-Coupled TMF Constitutive Model for Solder Alloy," Int. J. Damage Mech., 10(2), pp. 133-152.
10. Wei, Y., Chow, C. L., Neilsen, M. K., and Fang, H. E., 2002, "Failure Analysis of Solder Joints with a Damage-Coupled Viscoplastic Model," Int. J. Numer. Methods Eng., 56, pp. 2199-2211.