Orientation imaging studies of Sn-based electronic solder joints

Journal of Materials Research

Volumn 17, Issue 9, 2002, Pages 2294-2306

  Telang, A U ^a   Bieler, T R ^a   Choi, S ^a   Subramanian, K N ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; AGING OF MATERIALS; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; GRAIN BOUNDARIES; STRAIN; THERMAL EFFECTS; TIN;

ORIENTATION IMAGING MICROSCOPY; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

EID: 0036710411     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2002.0337     Document Type: Article

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