Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4981, Issue , 2003, Pages

  Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DENSE WAVELENGTH DIVISION MULTIPLEXING; DIFFRACTION GRATINGS; ELECTRONICS PACKAGING; MICROELECTRONICS; MICROOPTICS; OPTICAL COLLIMATORS; PHOTODETECTORS; PHOTORESISTORS; SEMICONDUCTOR LASERS; THIN FILMS; VACUUM APPLICATIONS; ACTUATORS; BONDING; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; SENSORS;

VACUUM MICROPACKAGING; MICROSYSTEMS;

MICROELECTROMECHANICAL DEVICES; ELECTRONICS PACKAGING;

EID: 0037721379     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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