Micropackaging technologies for integrated microsystems: Applications to MEMS and MOEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4982, Issue , 2003, Pages

  Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; OPTOELECTRONIC DEVICES; BIOMEDICAL EQUIPMENT; BONDING; ELECTRONICS PACKAGING; ENVIRONMENTAL ENGINEERING; MICROOPTICS; PARTIAL PRESSURE SENSORS; POWER GENERATION; SIGNAL PROCESSING; THIN FILMS; TRANSDUCERS; HERMETIC SEALS; INTEGRATED CIRCUITS; INTEGRATED OPTOELECTRONICS; MICROELECTRONICS;

MICROPACKAGING; MICROSYSTEMS; VACUUM MICROPACKAGING;

ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; CHIP SCALE PACKAGES;

EID: 0037720149     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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