메뉴 건너뛰기




Volumn 51, Issue , 2014, Pages 37-47

Effect of intermetallic compound thickness on shear strength of 25 μm diameter Cu-pillars

Author keywords

A. Multiphase intermetallics; B. Bonding; C. Joining; D. Phase interfaces; F. Mechanical testing

Indexed keywords

HEAT TREATMENT; INTERMETALLICS; MECHANICAL TESTING; PHASE INTERFACES; SHEARING; SHEARING MACHINES; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; TIN;

EID: 84897392638     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2014.02.012     Document Type: Article
Times cited : (36)

References (37)
  • 5
    • 20344388336 scopus 로고    scopus 로고
    • Interfacial reactions between lead-free solders and common base materials
    • DOI 10.1016/j.mser.2005.03.001, PII S0927796X05000513
    • T. Laurila, V. Vuorinen, and J.K. Kivilahti Interfacial reactions between lead-free solders and common base materials Mater Sci Eng R 49 2005 1 60 (Pubitemid 40788671)
    • (2005) Materials Science and Engineering R: Reports , vol.49 , Issue.1-2 , pp. 1-60
    • Laurila, T.1    Vuorinen, V.2    Kivilahti, J.K.3
  • 6
    • 57349196368 scopus 로고    scopus 로고
    • Intermetallic formation of copper pillar with Sn-Ag-Cu for flip-chip-on-module packaging
    • M. Huang, O.G. Yeow, C.Y. Poo, and T. Jiang Intermetallic formation of copper pillar with Sn-Ag-Cu for flip-chip-on-module packaging Transac Comp Packag Technol 31 2008 767 775
    • (2008) Transac Comp Packag Technol , vol.31 , pp. 767-775
    • Huang, M.1    Yeow, O.G.2    Poo, C.Y.3    Jiang, T.4
  • 8
    • 19944432174 scopus 로고    scopus 로고
    • Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability
    • K.J. Zeng, R. Stierman, T.C. Chiu, D. Edwards, K. Ano, and K.N. Tu Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability J Appl Phys 97 2005 024508
    • (2005) J Appl Phys , vol.97 , pp. 024508
    • Zeng, K.J.1    Stierman, R.2    Chiu, T.C.3    Edwards, D.4    Ano, K.5    Tu, K.N.6
  • 10
    • 60849105954 scopus 로고    scopus 로고
    • Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates
    • Y.W. Wang, Y.W. Lin, and C.R. Kao Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates Microelectron Reliab 49 2009 248 252
    • (2009) Microelectron Reliab , vol.49 , pp. 248-252
    • Wang, Y.W.1    Lin, Y.W.2    Kao, C.R.3
  • 11
    • 24644438312 scopus 로고    scopus 로고
    • Kirkendall voids at Cu/solder interface and their effects on solder joint reliability
    • 2005 Proceedings - 55th Electronic Components and Technology Conference, ECTC
    • Z.Q. Mei, M. Ahmad, M. Hu, and G. Ramakrishna Kirkendall voids at Cu/solder interface and their effects on solder joint reliability Proceeding of electronic components and technology conference 2005 415 420 (Pubitemid 41276204)
    • (2005) Proceedings - Electronic Components and Technology Conference , vol.1 , pp. 415-420
    • Mei, Z.1    Ahmad, M.2    Hu, M.3    Ramakrishna, G.4
  • 12
    • 78650699789 scopus 로고    scopus 로고
    • Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
    • J.F. Li, P.A. Agyakwa, and C.M. Johnson Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process Acta Mater 59 2011 1198 1211
    • (2011) Acta Mater , vol.59 , pp. 1198-1211
    • Li, J.F.1    Agyakwa, P.A.2    Johnson, C.M.3
  • 14
    • 82255164230 scopus 로고    scopus 로고
    • Elimination of voids in reactions between Ni and Sn: A novel effect of silver
    • H.Y. Chuang, J.J. Yu, M.S. Kuo, H.M. Tong, and C.R. Kao Elimination of voids in reactions between Ni and Sn: a novel effect of silver Scr Mater 66 2012 171 174
    • (2012) Scr Mater , vol.66 , pp. 171-174
    • Chuang, H.Y.1    Yu, J.J.2    Kuo, M.S.3    Tong, H.M.4    Kao, C.R.5
  • 16
    • 78149406065 scopus 로고    scopus 로고
    • Intermetallic compound growth and reliability of Cu pillar bumps under current stressing
    • B.J. Kim, G.T. Lim, J. Kim, K. Lee, Y.B. Park, and H.Y. Lee et al. Intermetallic compound growth and reliability of Cu pillar bumps under current stressing J Electron Mater 39 2010 2281 2285
    • (2010) J Electron Mater , vol.39 , pp. 2281-2285
    • Kim, B.J.1    Lim, G.T.2    Kim, J.3    Lee, K.4    Park, Y.B.5    Lee, H.Y.6
  • 19
    • 30944460146 scopus 로고    scopus 로고
    • Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application
    • J.W. Kim, D.G. Kim, and S.B. Jung Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application Microelectron Reliab 46 2006 535 542
    • (2006) Microelectron Reliab , vol.46 , pp. 535-542
    • Kim, J.W.1    Kim, D.G.2    Jung, S.B.3
  • 20
    • 35549012747 scopus 로고    scopus 로고
    • Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging
    • J.M. Koo, and S.B. Jung Effect of displacement rate on ball shear properties for Sn-37Pb and Sn-3.5Ag BGA solder joints during isothermal aging Microelectron Reliab 47 2007 2169 2178
    • (2007) Microelectron Reliab , vol.47 , pp. 2169-2178
    • Koo, J.M.1    Jung, S.B.2
  • 23
    • 80054070088 scopus 로고    scopus 로고
    • Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing
    • Y. Tian, C. Hang, C. Wang, S. Yang, and P. Lin Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing Mater Sci Eng A 529 2011 468 478
    • (2011) Mater Sci Eng A , vol.529 , pp. 468-478
    • Tian, Y.1    Hang, C.2    Wang, C.3    Yang, S.4    Lin, P.5
  • 24
    • 18844449242 scopus 로고    scopus 로고
    • Correlation between displacement rate and shear force in shear test of Sn-Pb and lead free solder joints
    • DOI 10.1179/174328405X29258
    • J.W. Kim, J. Joo, D.J. Quesnel, and S.B. Jung Correlation between displacement rate and shear force in shear test of Sn-Pb and lead free solder joints Mater Sci Technol 21 2005 373 380 (Pubitemid 40680107)
    • (2005) Materials Science and Technology , vol.21 , Issue.3 , pp. 373-380
    • Kim, J.-W.1    Joo, J.2    Quesnel, D.J.3    Jung, S.-B.4
  • 25
    • 35348832874 scopus 로고    scopus 로고
    • Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests
    • DOI 10.1109/ECTC.2007.373824, 4249910, Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
    • F. Song, S.W.R. Lee, K. Newman, B. Sykes, and S. Clark Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests Proceeding of electronic components and technology conference 2007 364 372 (Pubitemid 47577057)
    • (2007) Proceedings - Electronic Components and Technology Conference , pp. 364-372
    • Song, F.1    Ricky Lee, S.W.2    Newman, K.3    Sykes, B.4    Clark, S.5
  • 27
    • 42949086874 scopus 로고    scopus 로고
    • Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints
    • D.G. Kim, J.W. Kim, S.S. Ha, B.I. Noh, J.M. Koo, and D.W. Park et al. Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints J Alloys Compd 458 2008 253 260
    • (2008) J Alloys Compd , vol.458 , pp. 253-260
    • Kim, D.G.1    Kim, J.W.2    Ha, S.S.3    Noh, B.I.4    Koo, J.M.5    Park, D.W.6
  • 28
    • 84872098975 scopus 로고    scopus 로고
    • Single-joint shear strength of micro Cu pillar solders bumps with different amounts of intermetallics
    • Y.J. Chen, C.K. Chung, C.R. Yang, and C.R. Kao Single-joint shear strength of micro Cu pillar solders bumps with different amounts of intermetallics Microelectron Reliab 53 2013 47 52
    • (2013) Microelectron Reliab , vol.53 , pp. 47-52
    • Chen, Y.J.1    Chung, C.K.2    Yang, C.R.3    Kao, C.R.4
  • 29
    • 84883536145 scopus 로고    scopus 로고
    • Reflow processes in micro-bumps studied by synchrotron X-ray projection nanotomography
    • J. Bertheau, P. Bleuet, F. Hodaj, P. Cloetens, N. Martin, and J. Charbonnier et al. Reflow processes in micro-bumps studied by synchrotron X-ray projection nanotomography Microelectron Eng 113 2013 123 129
    • (2013) Microelectron Eng , vol.113 , pp. 123-129
    • Bertheau, J.1    Bleuet, P.2    Hodaj, F.3    Cloetens, P.4    Martin, N.5    Charbonnier, J.6
  • 30
    • 35348836024 scopus 로고    scopus 로고
    • Factors affecting wettability and bond strength of solder joint couples
    • N. Sobczak, A. Kudyba, R. Nowak, W. Radziwill, and K. Pietrzak Factors affecting wettability and bond strength of solder joint couples Pure Appl Chem 79 2007 1755 1769
    • (2007) Pure Appl Chem , vol.79 , pp. 1755-1769
    • Sobczak, N.1    Kudyba, A.2    Nowak, R.3    Radziwill, W.4    Pietrzak, K.5
  • 32
    • 84874825981 scopus 로고    scopus 로고
    • Three-dimensional imaging of copper pillars using x-ray tomography within a scanning electron microscope: A simulation study based on synchrotron data
    • N. Martin, J. Bertheau, P. Bleuet, J. Charbonnier, P. Hugonnard, and D. Laloum et al. Three-dimensional imaging of copper pillars using x-ray tomography within a scanning electron microscope: a simulation study based on synchrotron data Rev Sci Instrum 84 2013 023708
    • (2013) Rev Sci Instrum , vol.84 , pp. 023708
    • Martin, N.1    Bertheau, J.2    Bleuet, P.3    Charbonnier, J.4    Hugonnard, P.5    Laloum, D.6
  • 33
    • 0037076832 scopus 로고    scopus 로고
    • Six cases of reliability study of Pb-free solder joints in electronic packaging technology
    • K. Zeng, and K.N. Tu Six cases of reliability study of Pb-free solder joints in electronic packaging technology Mater Sci Eng R 38 2002 55 105
    • (2002) Mater Sci Eng R , vol.38 , pp. 55-105
    • Zeng, K.1    Tu, K.N.2
  • 35
    • 0742287928 scopus 로고    scopus 로고
    • Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation
    • DOI 10.1016/j.msea.2003.08.032
    • X. Deng, M. Koopman, N. Chawla, and K.K. Chawla Young's modulus of (Cu, Ag)-Sn intermetallics measured by nanoindentation Mater Sci Eng A 364 2004 240 243 (Pubitemid 38158064)
    • (2004) Materials Science and Engineering A , vol.364 , Issue.1-2 , pp. 240-243
    • Deng, X.1    Koopman, M.2    Chawla, N.3    Chawla, K.K.4
  • 36
    • 0027870291 scopus 로고
    • Bonding, structure and properties of metal-ceramic interfaces. 1. Chemical bonding, chemical reaction, and interfacial structure
    • J.M. Howe Bonding, structure and properties of metal-ceramic interfaces. 1. Chemical bonding, chemical reaction, and interfacial structure Int Mater Rev 38 1993 233 256
    • (1993) Int Mater Rev , vol.38 , pp. 233-256
    • Howe, J.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.