Factors affecting wettability and bond strength of solder joint couples

Pure and Applied Chemistry

Volumn 79, Issue 10, 2007, Pages 1755-1769

  Sobczak, Natalia ^a   Kudyba, Artur ^a   Nowak, Rafal ^a   Radziwill, Waldemar ^a   Pietrzak, Krystyna ^b  

^a Lukasiewicz Research Network Krakow Institute of Technology   (Poland)

^b MOTOR TRANSPORT INSTITUTE   (Poland)

Author keywords

Bond strength; Interfaces; Sessile drop test; Soldering; Wettability

Indexed keywords

EID: 35348836024     PISSN: 00334545     EISSN: None     Source Type: Journal    
DOI: 10.1351/pac200779101755     Document Type: Conference Paper

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