Correlation between displacement rate and shear force in shear test of Sn-Pb and lead free solder joints

Materials Science and Technology

Volumn 21, Issue 3, 2005, Pages 373-380

  Kim, J W ^a   Joo, J ^a   Quesnel, D J ^b   Jung, S B ^a  

^a Sungkyunkwan University   (South Korea)

^b University of Rochester   (United States)

Author keywords

BGA; Finite element analysis; Shear test; Sn 3.5Ag; Sn 37Pb

Indexed keywords

CORRELATION METHODS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); LEAD; SOLDERING ALLOYS; STRAIN; TIN;

BGA; SHEAR RATE; SN-37PB; STRAIN ENERGY;

SOLDERED JOINTS;

EID: 18844449242     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328405X29258     Document Type: Article

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