Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 364-372

  Song, Fubin ^a   Ricky Lee, S W ^a   Newman, Keith ^b   Sykes, Bob ^c   Clark, Stephen ^c  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SUN MICROSYSTEMS   (United States)

^c DAGE Holdings Limited

Author keywords

[No Author keywords available]

Indexed keywords

BALL SHEAR TESTS; INTERFACIAL FRACTURE; SOLDER ALLOYS; SOLDER BALLS;

BRITTLE FRACTURE; CORRELATION METHODS; FAILURE ANALYSIS; MICROSTRUCTURE; TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 35348832874     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373824     Document Type: Conference Paper

References (10)

1. A. T. Valota, A. Losavio, et al " High Speed Pull Test Characterization of BGA Solder Joints," Proc. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in MicroElectronics and Micro-Systems, 2006. EuroSime 2006. Milano, Italy, April (2006).
2. K. Newman, "BGA Brittle Fracture-Alternative Solder joint Integrity Test Methods," Proc. 55th Electronic Components & Technology Conference, Orlando, FL, June (2005), pp. 1194-1200.
3. Julian Yan Hon Chia, et al., "The mechanics of the solder ball shear test and the effect of shear rate," Materials Science and Engineering A 417 (2006) 259-274.
4. th Electr. Comp. Technol. Conf, Lake Buena Vista, FL, 2005, pp. 1202-1209.
5. X. Huang, S. W. R. Lee, C. C. Yan and S. Hui, "Characterization and Analysis on the Solder Ball Shear Testing Conditions," Proc. 51st Electronic Components & Technology Conference, Orlando, FL, June (2001), pp. 1065-1071.
6. S. Sane, S. Tandon and B, Chandran, "On Measurement of Effective Silicon Backend Strength using Bump Pull/Shear Techniques," Proc. ASME InterPACK 2005, San Francisco, CA, July (2005).
7. Raiser, G., et al., "Solder Joint Reliability Improvement Using the Cold Ball Pull Metrology," Proc. ASME InterPACK 2005, San Francisco, CA, July 17-22, 2005.
8. F. B. Song and S. W. R. Lee, "Investigation of IMC Thickness Effect on the Lead-free Solder Ball Attachment Strength-Comparison between Ball Shear Test and Cold Bump Pull Test Results," Proc. 56th Electronic Components & Technology Conference, San Diego, CA, June 2006, pp. 1196-1203.
9. F. B. Song, S. W. R. Lee, K. Newman, B. Sykes and S. Clark, "High Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed," Proc. 57th Electronic Components & Technology Conference, Reno, NV, June 2007.
10. C. Brizer, et al "Drop Test Reliability Improvement of Lead-free Fine Pitch BGA Using Different Solder Ball Composition," Proc. 55th Electronic Components & Technology Conference, Orlando, FL, June (2005), pp. 1194-1200.